5AGXFB1H4F35I3G

The 5AGXFB1H4F35I3G is an Intel Arria V GX field-programmable gate array (FPGA) in an industrial-grade offering. This device provides high logic capacity and abundant I/O in a compact surface-mount FCBGA package, delivering a platform for complex, board-level programmable logic implementations where thermal management and wide operating temperature are required.

Key Features

• High Logic Capacity — Contains 300,000 logic elements to implement large-scale digital designs and custom hardware acceleration.
• Embedded Memory — Approximately 17.36 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• Extensive I/O — 544 user I/O pins to support dense connectivity and multiple parallel interfaces on a single device.
• Package and Mounting — 1152-BBGA FCBGA exposed pad package (supplier package: 1152-FBGA 35×35) designed for surface-mount assembly and robust board integration.
• Power — Core voltage supply range of 1.12 V to 1.18 V, enabling predictable core-power planning for system design.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C, suitable for extended-temperature deployments.
• Compliance — RoHS-compliant device for environmentally conscious designs and supply-chain requirements.

Typical Applications

• Industrial Automation — Implements complex control logic, deterministic I/O handling, and on-board signal processing within industrial temperature environments.
• High-Density I/O Systems — Serves as a central programmable fabric for systems requiring hundreds of I/Os for sensors, peripherals, or parallel buses.
• Custom Hardware Acceleration — Enables application-specific acceleration using the device’s large pool of logic elements and embedded memory.

Unique Advantages

• Large Programmable Fabric: 300,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing component count.
• Substantial On-Chip Memory: Approximately 17.36 Mbits of embedded RAM supports buffering and stateful processing without external memory in many designs.
• High I/O Count: 544 I/Os enable flexible partitioning of interfaces and high parallelism for system-level integration.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for deployment in extended-temperature environments.
• Board-Level Package: 1152-BBGA FCBGA with exposed pad supports surface-mount assembly and provides a thermal/mechanical interface suited for dense PCBs.
• Predictable Core Power: Narrow core voltage range (1.12 V–1.18 V) simplifies power-supply design and sequencing considerations.

Why Choose 5AGXFB1H4F35I3G?

The 5AGXFB1H4F35I3G Arria V GX FPGA combines substantial logic resources, sizable embedded memory, and a high I/O count in an industrial-temperature FCBGA package. It is positioned for designs that need consolidated programmable logic, extensive interfacing, and reliable operation across a wide temperature range. Backed by Arria V device documentation, the device supports engineers building robust, scalable hardware platforms that require predictable power and board-level integration.

If you need a quote, availability details, or assistance specifying this FPGA into your design, request a quote or submit an inquiry to obtain pricing and lead-time information.