5AGXFB1H4F35I5G

The 5AGXFB1H4F35I5G is an Arria V GX field programmable gate array offering high logic density and substantial on-chip memory in a compact FCBGA exposed‑pad package. It provides 300,000 logic elements, approximately 17.36 Mbits of embedded memory, and 544 device I/Os to support complex, high‑integration FPGA designs.

Supplied in a 1152‑BBGA / 1152‑FBGA (35×35) surface‑mount package with industrial temperature range and a narrow core voltage window, this device is intended for applications that require robust logic and memory resources along with extensive I/O connectivity.

Key Features

• Core Capacity — 300,000 logic elements to implement large-scale combinational and sequential logic functions.
• Embedded Memory — Approximately 17.36 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Count — 544 device I/Os to support wide parallel interfaces and multiple high‑pincount peripherals.
• Package & Mounting — 1152‑BBGA (FCBGA exposed pad) / supplier package 1152‑FBGA (35×35) in a surface‑mount form factor for dense board layouts.
• Power — Core supply operating range of 1.07 V to 1.13 V to define power rail requirements precisely.
• Temperature & Grade — Industrial grade operation from −40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control: Large logic capacity and industrial temperature rating enable implementation of complex control algorithms, real‑time processing, and machine‑level I/O aggregation.
• High‑Density Signal Processing: Substantial embedded memory and logic elements support buffering, data manipulation, and parallel DSP workflows.
• Embedded System Integration: Extensive I/O count and high logic density facilitate consolidation of multiple peripheral interfaces and custom system logic into a single device.

Unique Advantages

• High Logic Density: 300,000 logic elements provide the headroom to implement complex state machines, custom accelerators, and large glue‑logic functions without partitioning across multiple devices.
• Significant On‑Chip Memory: Approximately 17.36 Mbits of embedded RAM reduces reliance on external memory for intermediate buffering and low‑latency data paths.
• Broad I/O Capability: 544 I/Os allow flexible interfacing to numerous peripherals and wide parallel buses, simplifying board-level routing and system integration.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature‑sensitive industrial applications.
• Compact, Assembly‑Friendly Package: 1152‑BBGA / 1152‑FBGA (35×35) surface‑mount package with exposed pad supports high‑density PCB layouts and thermal management.
• RoHS Compliant: Conforms to RoHS environmental requirements for better regulatory alignment in production designs.

Why Choose 5AGXFB1H4F35I5G?

The 5AGXFB1H4F35I5G Arria V GX FPGA combines large logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA exposed‑pad package, making it well suited for engineers who need to consolidate complex functions into a single programmable device. Its defined core voltage range and industrial temperature rating support predictable power design and reliable operation in demanding environments.

This device is targeted at designs requiring scalable logic and memory resources with extensive interfacing options—delivering integration and flexibility to shorten development time and reduce BOM complexity while meeting industrial temperature and environmental requirements.

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