5AGXFB1H4F35I5N

The 5AGXFB1H4F35I5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA exposed-pad package. It combines a high logic element count with substantial on-chip memory and a large I/O complement, aimed at designs that require high-density programmable logic and significant embedded RAM.

Key hardware characteristics include 300,000 logic elements, approximately 17.36 Mbits of embedded memory, 544 I/O pins, an industrial operating temperature range of −40 °C to 100 °C, and a nominal supply window of 1.07 V to 1.13 V.

Key Features

• Core Capacity 300,000 logic elements provide a high level of programmable logic resources for complex designs.
• Embedded Memory Approximately 17.36 Mbits of on-chip RAM (17,358,848 bits) for local buffering and intermediate storage.
• I/O Density 544 general-purpose I/O pins to support extensive interfacing on a single device.
• Power Supply Narrow operating supply range of 1.07 V to 1.13 V to simplify core power planning.
• Package and Mounting 1152-BBGA, FCBGA exposed pad package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for high board density.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control Use where industrial temperature rating and high logic/I/O density are required for machine control, motor drives, and factory automation interfaces.
• Communications Infrastructure Deploy for protocol implementation and packet processing tasks that benefit from significant on-chip memory and extensive I/O.
• High-density Data Processing Suitable for inline data handling and custom processing pipelines that require large logic resources and local RAM.
• Custom Embedded Systems Ideal for bespoke embedded designs needing a compact BGA package with substantial programmable resources and many external connections.

Unique Advantages

• High logic density: 300,000 logic elements enable integration of complex functions into a single device, reducing external components.
• Substantial embedded memory: Approximately 17.36 Mbits of on-chip RAM supports buffering and state storage without immediate reliance on external memory.
• Extensive I/O count: 544 I/O pins simplify system partitioning and reduce the need for multiple interface devices.
• Industrial operating range: Rated from −40 °C to 100 °C for deployments in temperature-challenging environments.
• Compact BGA package: 1152-BBGA (35×35) exposed-pad package provides a small board footprint with thermal management options.
• Predictable core supply: Tight voltage window (1.07–1.13 V) helps streamline core power delivery design.

Why Choose 5AGXFB1H4F35I5N?

This Arria V GX FPGA balances high programmable logic capacity, meaningful on-chip memory, and a large I/O complement in a compact BGA package rated for industrial temperatures. It is positioned for designs that require integration of complex logic functions and significant local memory while maintaining robust operation across a wide temperature range.

Engineers targeting high-density embedded systems, communications equipment, or industrial automation designs will find the 5AGXFB1H4F35I5N suitable where consolidation of functions, I/O flexibility, and predictable power/thermal characteristics are priorities.

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