5AGXFB1H4F35I3N

The 5AGXFB1H4F35I3N is an Arria V GX field-programmable gate array (FPGA) from Intel, offered in an industrial-grade device. It delivers high logic density, substantial on-chip memory, and a large I/O count in a 1152-ball BGA package with an exposed pad, enabling complex system integration for industrial and embedded applications. Detailed electrical and configuration specifications are provided in the Arria V device datasheet.

Key Features

• Logic Capacity: Approximately 300,000 logic elements for implementing complex digital designs and custom algorithms.
• Embedded Memory: Approximately 17.36 Mbits of embedded memory for buffering, packet processing, and data storage.
• I/O Density: 544 user I/O pins to support high-pin-count interfaces and dense peripheral connectivity.
• Package & Mounting: 1152-BBGA (FCBGA exposed pad) / supplier package 1152-FBGA (35×35); surface-mount construction for board-level integration with thermal pad.
• Power Supply: Core supply operates from 1.12 V to 1.18 V, enabling defined core-voltage design and power sequencing.
• Industrial Temperature Range: Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance: RoHS-compliant material declaration.

Typical Applications

• Industrial Control: High logic capacity and industrial temperature rating supporting complex control logic and deterministic processing in automation systems.
• Networking & Telecom: Large embedded memory and high I/O count enable packet buffering and multi-channel interface integration.
• Signal Processing: Dense logic resources and on-chip RAM suitable for FPGA-based filtering, aggregation, and custom DSP pipelines.
• Prototyping & Accelerator Boards: Substantial logic and I/O resources make the device suitable for hardware acceleration and rapid prototyping of system designs.

Unique Advantages

• High Logic Density: Approximately 300,000 logic elements let you implement large custom architectures without external logic.
• Significant On‑Chip Memory: Around 17.36 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 544 I/Os facilitate multi-protocol interfaces and complex board-level connectivity without multiplexing compromises.
• Industrial Readiness: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh environments.
• Thermally Aware Package: FCBGA exposed-pad package and 35×35 supplier package format aid thermal conduction and board-level heat management.
• Defined Core Voltage: 1.12–1.18 V supply range provides clear power-rail requirements for system power design.

Why Choose 5AGXFB1H4F35I3N?

The 5AGXFB1H4F35I3N positions itself as a high-density, industrial-grade FPGA option within the Arria V GX family—combining a large number of logic elements, substantial embedded memory, and a high I/O count in a thermally conscious BGA package. It is suited for engineers designing complex, memory- and I/O‑intensive systems requiring predictable thermal and power characteristics.

Backed by the Arria V device datasheet and Intel documentation, this device supports designs where logic capacity, on-chip RAM, and robust operating temperature range are key selection criteria.

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