5AGXFB1H4F35C5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 17358848 300000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 1,831 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXFB1H4F35C5N – Arria V GX FPGA, 300,000 logic elements, 1152‑BBGA
The 5AGXFB1H4F35C5N is an Arria V GX Field Programmable Gate Array (FPGA) optimized for high-density logic integration. It delivers 300,000 logic elements and approximately 17.36 Mbits of embedded memory, paired with 544 user I/Os to support complex, I/O‑heavy designs in commercial applications. With a tightly specified core supply range and standard commercial temperature rating, this device suits designs that require substantial on‑chip resources and a high I/O count in a compact ball‑grid package.
Key Features
- Core density 300,000 logic elements (cells) to implement complex digital logic and custom accelerators.
- Embedded memory Approximately 17.36 Mbits of on‑chip RAM for data buffering, state storage, and local scratch memory.
- I/O capacity 544 user I/Os to support broad peripheral connectivity and multi‑channel interfaces.
- Power supply Specified core voltage range of 1.07 V to 1.13 V for precise power design and regulation.
- Package and mounting 1152‑BBGA (FCBGA exposed pad), supplier package 1152‑FBGA (35×35); surface‑mountable for dense PCB layouts.
- Operating range Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental compliance RoHS compliant to support regulatory and manufacturing requirements.
Typical Applications
- High‑density digital processing — Implement complex logic functions, custom datapaths, and hardware accelerators that require a large logic fabric and embedded memory.
- Multi‑interface systems — Support designs needing many parallel or serialized interfaces, leveraging 544 I/Os for external peripherals and board‑level interconnects.
- Prototyping and development — Use as a development platform for evaluating large FPGA designs and consolidating multiple functions onto a single device.
Unique Advantages
- High logic capacity: 300,000 logic elements enable implementation of sizable, integrated digital systems without external glue logic.
- Substantial on‑chip memory: Approximately 17.36 Mbits of embedded RAM reduces external memory dependency for many buffering and storage needs.
- Extensive I/O count: 544 I/Os provide flexibility to connect multiple peripherals, sensors, or interface channels directly to the FPGA.
- Compact, high‑pin package: The 1152‑BBGA FCBGA package delivers a high pin count in a board‑friendly form factor for dense PCB implementations.
- Commercial temperature and RoHS compliance: Designed for standard commercial environments and compliant with RoHS requirements for manufacturing and assembly.
Why Choose 5AGXFB1H4F35C5N?
The 5AGXFB1H4F35C5N offers a balanced combination of logic density, embedded memory, and I/O capacity in a single, surface‑mount 1152‑BBGA package. Its defined core voltage range and commercial operating temperature make it suitable for product designs that require deterministic electrical specifications and substantial on‑chip resources.
This device is well suited to engineers and teams consolidating multiple functions onto a single FPGA or developing I/O‑intensive systems that benefit from high logic capacity and significant embedded RAM. Detailed electrical and configuration specifications for Arria V devices are provided in the device datasheet to support system design and validation.
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