5AGXFB1H4F35C4G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 17358848 300000 1152-BBGA, FCBGA

Quantity 733 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14151Number of Logic Elements/Cells300000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits17358848

Overview of 5AGXFB1H4F35C4G – Arria V GX FPGA, 300,000 logic elements, 544 I/O, 1152‑BBGA

The 5AGXFB1H4F35C4G is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 1152‑ball BBGA (FCBGA) package. It provides a high-density, commercial‑grade programmable logic platform with 300,000 logic elements and wide I/O capability for applications that require significant on‑chip logic and memory resources.

Designed for systems requiring many I/O and substantial embedded memory, this device targets dense logic consolidation, custom signal processing, and complex interfacing tasks while operating within standard commercial temperature and voltage ranges.

Key Features

  • Logic Capacity — 300,000 logic elements (cells) to implement large, consolidated digital designs and complex custom logic functions.
  • Embedded Memory — Approximately 17.36 Mbits of on‑chip RAM for buffering, data storage, and state machines without external memory in many use cases.
  • I/O Density — 544 I/O pins to support extensive peripheral, sensor, and bus interfacing directly from the FPGA package.
  • Package — 1152‑BBGA (FCBGA) supplier device package (1152‑FBGA, FC, 35×35) for compact, high‑lead‑count board implementations.
  • Power Supply — Core supply specified between 1.07 V and 1.13 V, enabling predictable core power budgeting and supply design.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C to meet typical commercial system environments.
  • Mounting — Surface mount package for standard PCB assembly processes.
  • RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

  • High‑density FPGA designs — Consolidate multiple logic functions into a single device using 300,000 logic elements and substantial embedded RAM.
  • Data interfacing and aggregation — Use 544 I/O lines for broad peripheral and bus connectivity in data collection and aggregation systems.
  • Custom signal processing — Implement application‑specific processing pipelines that benefit from on‑chip RAM and large logic capacity.

Unique Advantages

  • Large programmable fabric — 300,000 logic elements provide the headroom needed for complex, multi‑function designs without immediate partitioning across devices.
  • Significant on‑chip memory — Approximately 17.36 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive I/O count — 544 user I/O pins facilitate dense interfacing, lowering the need for external multiplexing or GPIO expanders.
  • Commercial temperature support — Rated 0 °C to 85 °C for reliable operation in standard commercial deployments.
  • Predictable power rails — Defined core voltage range (1.07 V–1.13 V) simplifies power supply design and margining.
  • RoHS compliant — Aligns with environmental regulatory requirements for many mainstream products.

Why Choose 5AGXFB1H4F35C4G?

The 5AGXFB1H4F35C4G delivers a balanced combination of large logic capacity, substantial embedded memory, and a high I/O count in a compact 1152‑BBGA package. As a commercial‑grade Arria V GX FPGA, it is well suited for teams needing to consolidate complex logic, implement custom data paths, and support broad system interfaces while maintaining predictable supply and thermal envelopes.

This part is appropriate for design teams and procurement sourcing components for medium‑to‑high complexity systems where on‑chip resources and I/O density can reduce board-level complexity and bill of materials. Its RoHS compliance and standard mounting make it straightforward to integrate into commercial product development flows.

Request a quote or submit an inquiry to receive pricing, lead‑time, and availability information for the 5AGXFB1H4F35C4G Arria V GX FPGA.

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