5AGXFB1H4F35I3

The 5AGXFB1H4F35I3 is an Arria V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152-BBGA FCBGA package. It provides a high count of logic elements, substantial embedded RAM, and a dense I/O complement, designed for industrial-grade applications.

With a supply voltage window of 1.12 V to 1.18 V and an operating temperature range from −40 °C to 100 °C, this device is targeted at systems that require large programmable logic capacity, significant on-chip memory, and broad I/O connectivity in a surface-mount BGA form factor.

Key Features

• Core Logic  Approximately 452,832 logic elements provide large-scale programmable logic resources for complex designs.
• Logic Fabric Density  Specifications indicate 300,000 CLB-equivalent resources for implementing sizable custom logic architectures.
• Embedded Memory  Approximately 1.9 Mbits of on-chip RAM (1,896,448 total RAM bits) for data buffering, FIFOs, and local storage.
• I/O Capacity  544 dedicated I/O pins enable dense external interfacing and high channel counts for system-level connectivity.
• Power  Specified core supply range of 1.12 V to 1.18 V supports tight power delivery and predictable operation within the defined window.
• Package & Mounting  1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA, 35 × 35 mm; surface-mount mounting for compact board integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-demanding environments.
• Regulatory  RoHS compliant to support lead-free assembly and environmental requirements.

Typical Applications

• Industrial Systems  Fits industrial control and automation equipment where wide temperature operation and significant programmable logic are required.
• High-Density I/O Systems  Suitable for applications that need large numbers of external interfaces or parallel data channels thanks to 544 I/O pins.
• Embedded Memory-Intensive Designs  Appropriate for designs needing substantial on-chip RAM (approximately 1.9 Mbits) for buffering, packet handling, or local storage.

Unique Advantages

• Large Logic Capacity: Provides approximately 452,832 logic elements to implement complex algorithms and wide datapaths without immediate external logic.
• Significant On-Chip Memory: Nearly 1.9 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary storage needs.
• High I/O Density: 544 I/O pins enable extensive peripheral connectivity and parallel interfacing options.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in temperature-challenged environments.
• Surface-Mount BGA Package: 1152-BBGA (35 × 35 mm) provides a compact, board-friendly footprint for high-density system designs.
• RoHS Compliant: Meets lead-free assembly requirements for environmentally conscious production processes.

Why Choose 5AGXFB1H4F35I3?

The 5AGXFB1H4F35I3 Arria V GX FPGA delivers a blend of high logic density, ample embedded RAM, and broad I/O capability in an industrial-grade, surface-mount BGA package. Its specified supply voltage range and extended operating temperature make it suitable for robust system designs that demand reliable programmable logic resources.

This device is well suited for engineering teams building complex, high-channel-count systems that require on-chip memory and wide I/O connectivity while operating across an industrial temperature range. Its combination of capacity and packaging supports scalable designs where integration and predictable electrical/thermal behavior matter.

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