5AGXFA7H4F35I3N

The Intel 5AGXFA7H4F35I3N is an Arria V GX Field Programmable Gate Array (FPGA) offered in an industrial grade device package. It provides a high logic-density programmable fabric with extensive I/O capability and on-chip RAM suitable for complex, system-level integration.

Key device attributes include 242,000 logic elements, approximately 15.47 Mbits of embedded memory, 544 I/Os, and an industrial operating temperature range of −40 °C to 100 °C. The device is supplied for surface-mount assembly in a 1152-BBGA FCBGA exposed-pad package (supplier package: 1152-FBGA, 35×35) and is RoHS compliant.

Key Features

• Core logic density  Provides 242,000 logic elements for implementing large, custom digital designs and parallel processing pipelines.
• Embedded memory  Approximately 15.47 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory dependence.
• High I/O count  544 I/O pins enable dense peripheral, interface, and multi-channel signal integration directly on the FPGA.
• Industrial temperature range  Rated for operation from −40 °C to 100 °C to meet the environmental needs of industrial and embedded systems.
• Power supply range  Core voltage supply specified between 1.12 V and 1.18 V for core power planning and regulator selection.
• Package and mounting  1152-BBGA, FCBGA exposed pad package (supplier package: 1152-FBGA, 35×35) designed for surface-mount assembly and thermal management via the exposed pad.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial-grade operating range and robust logic/memory resources support control algorithms, I/O aggregation, and real-time processing in factory and process environments.
• High-density I/O systems  Large I/O count makes the device suitable for multi-interface hubs, protocol bridging, and systems requiring many independent signals.
• Embedded computing  Substantial logic and on-chip RAM support custom accelerators, glue logic, and integration of multiple functions into a single programmable device.
• Prototyping and system integration  Programmable fabric and large resource set enable development and validation of complex digital systems prior to production implementation.

Unique Advantages

• High logic capacity: 242,000 logic elements allow implementation of sizable digital designs without immediate partitioning or external logic.
• Significant on-chip memory: Approximately 15.47 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
• Extensive I/O: 544 I/Os provide flexibility when interfacing many peripherals, sensors, or high-channel-count front ends.
• Industrial-grade robustness: Specified operation from −40 °C to 100 °C supports deployment in demanding temperature environments.
• Compact, manufacturable package: 1152-BBGA / 1152-FBGA (35×35) surface-mount package with exposed pad supports thermal management and standard PCB assembly flows.
• Regulated core power: Narrow core voltage range (1.12 V–1.18 V) simplifies regulator selection and power budgeting for the core domain.

Why Choose 5AGXFA7H4F35I3N?

The 5AGXFA7H4F35I3N Arria V GX FPGA combines a large logic fabric, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount BBGA package. These attributes make it well suited for engineers designing integrated digital systems that require on-chip resources, dense I/O connectivity, and reliable operation across extended temperatures.

For projects that demand significant programmable logic and memory alongside robust I/O and industrial environmental capability, this device provides a compact, RoHS-compliant option with defined supply-voltage and thermal characteristics to support system-level planning and qualification.

Request a quote or submit an inquiry to receive pricing, availability, and delivery information for the 5AGXFA7H4F35I3N Arria V GX FPGA.