5AGXFA7H4F35C5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 283 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXFA7H4F35C5G – Arria V GX FPGA IC, 1152‑BBGA, 544 I/O
The 5AGXFA7H4F35C5G is an Intel Arria V GX field‑programmable gate array (FPGA) supplied in a 1152‑ball BGA package with exposed pad. It delivers high logic capacity and substantial embedded RAM in a surface‑mount 35×35 FBGA footprint, and is offered as a commercial‑grade device with an operating temperature range of 0 °C to 85 °C.
Designed for applications that require a combination of dense programmable logic, abundant I/O, and on‑chip memory, this device provides a hardware platform for complex digital processing and system integration while adhering to RoHS environmental requirements.
Key Features
- Core logic capacity — 11,460 LABs and 242,000 logic elements provide a high density of programmable logic for complex designs.
- Embedded memory — Approximately 15.47 Mbits of on‑chip RAM for data buffering, state storage, and memory‑intensive logic functions.
- I/O density — 544 user I/O pins enable broad connectivity for external peripherals, buses, and high‑pin‑count interfaces.
- Power supply — Core supply specified between 1.07 V and 1.13 V for stable core operation within defined operating limits.
- Package & mounting — 1152‑BBGA (FCBGA exposed pad) in a 1152‑FBGA (35×35) supplier package; surface‑mount mounting type supports modern assembly flows.
- Commercial grade temperature — Specified for 0 °C to 85 °C operation to match standard commercial applications.
- Regulatory status — RoHS compliant.
- Technical documentation — Datasheet coverage includes electrical characteristics, switching characteristics, configuration specifications (POR, JTAG, AS, PS), and I/O timing information to support system design and integration.
Typical Applications
- High‑density programmable logic systems — Use the device where a large pool of logic elements and embedded RAM are required to implement sophisticated digital functions.
- Multi‑interface controllers — 544 I/O pins support designs that combine numerous peripheral interfaces or parallel I/O channels.
- Embedded processing accelerators — Leverage the available logic and on‑chip memory to implement custom data‑path acceleration and buffering.
Unique Advantages
- High logic integration: 242,000 logic elements enable consolidation of complex functions into a single FPGA, reducing system BOM and board area.
- Substantial on‑chip memory: Approximately 15.47 Mbits of embedded RAM supports deeper buffering and stateful logic without immediate dependence on external memory.
- Large I/O complement: 544 user I/Os give flexibility to interface with multiple peripherals and high‑pin‑count subsystems.
- Compact, manufacturable package: 1152‑FBGA (35×35) with exposed pad and surface‑mount compatibility simplifies PCB layout for dense designs.
- Commercial operating range: Specified 0 °C to 85 °C operation suits a wide range of commercial applications and deployments.
- RoHS compliant: Meets environmental requirements for restricted substances.
Why Choose 5AGXFA7H4F35C5G?
The 5AGXFA7H4F35C5G Arria V GX FPGA combines high logic density, significant embedded memory, and a large I/O count in a compact 1152‑ball BGA package to support complex, integration‑focused designs. Its commercial temperature grading and narrow core voltage specification offer predictable operating conditions for production systems.
This device is well suited for engineers and procurement teams seeking a programmable platform that balances logic resources, on‑chip RAM, and I/O capability while providing detailed electrical and configuration specifications in the device datasheet to support robust design and verification.
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