5AGXFB1H6F35C6G

The 5AGXFB1H6F35C6G is an Arria V GX field-programmable gate array (FPGA) in a high-density 1152-ball FBGA/BBGA package. It provides a large programmable logic fabric—300,000 logic elements—combined with approximately 17.36 Mbits of on-chip RAM and 544 general-purpose I/O pins for systems requiring significant integration in a single surface-mount device.

Designed for commercial-grade applications, this device operates from a core supply range of 1.07 V to 1.13 V and supports an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and is supplied in a 1152-ball BGA footprint (supplier package listed as 1152-FBGA, FC; 35×35 mm).

Key Features

• High Logic Capacity — 300,000 logic elements provide substantial programmable resources for complex digital designs and algorithm implementation.
• On‑Chip Memory — Approximately 17.36 Mbits of embedded RAM for buffering, LUT-based memory, and large local storage requirements.
• Extensive I/O — 544 I/O pins to support multi‑lane interfaces, parallel buses, and mixed-signal front-end connectivity.
• Package and Mounting — 1152-ball FBGA/BBGA package in a surface-mount form factor (supplier package: 1152-FBGA, FC, 35×35 mm) for compact board-level integration.
• Power Rail — Core voltage operation between 1.07 V and 1.13 V to match system power-rail requirements and power-management strategies.
• Commercial Grade Operating Range — Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronics.
• Standards Compliance — RoHS compliant, supporting regulatory and environmental requirements.

Typical Applications

• High-density digital processing — Use the large logic fabric and embedded RAM to implement complex packet processing, DSP pipelines, or algorithm acceleration.
• Interface aggregation and bridging — Leverage 544 I/Os to consolidate multi-protocol interfaces and perform protocol adaptation on a single device.
• System integration and control — Integrate control logic, state machines, and peripheral interfaces into a compact surface-mount FPGA-based solution.

Unique Advantages

• Scalable logic resources: 300,000 logic elements allow designers to map large finite-state machines, custom datapaths, and parallel compute structures without immediate partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 17.36 Mbits of embedded memory reduces external memory dependence and simplifies board routing for buffer- and cache‑intensive designs.
• High I/O density: 544 I/O pins provide flexibility for wide buses, dense peripheral connections, and multiple simultaneous interfaces.
• Compact, manufacturable package: 1152-ball FBGA/BBGA supports compact PCB layouts and automated surface-mount assembly.
• Design-ready electrical window: Narrow core voltage range (1.07–1.13 V) and defined commercial temperature range simplify power sequencing and thermal planning for commercial products.
• Regulatory alignment: RoHS compliance supports environmental regulations and end-product compliance workflows.

Why Choose 5AGXFB1H6F35C6G?

The 5AGXFB1H6F35C6G Arria V GX FPGA combines substantial programmable logic, significant on-chip memory, and high I/O density in a single surface-mount package, making it well suited to commercial designs that require integration of complex digital functions and multiple interfaces. Its electrical specifications—defined core voltage range and commercial temperature rating—support predictable power and thermal planning in production systems.

This part targets designers who need a large, integrated FPGA resource in a compact BGA footprint and who require traceable, datasheet-specified operating conditions and compliance status for commercial product development.

Request a quote or submit a product inquiry to receive lead-time and pricing information for 5AGXFB1H6F35C6G.