5AGXFB1H6F35C6N

The 5AGXFB1H6F35C6N is an Intel Arria V GX FPGA delivered in a 1152-BBGA FCBGA exposed-pad package for surface-mount assembly. It provides substantial programmable logic capacity, embedded RAM, and a large I/O count for designs that require density and flexible interfacing within a commercial-temperature environment.

Key hardware parameters include 300,000 logic elements, approximately 17.36 Mbits of on-chip RAM, 544 user I/Os, a core supply range of 1.07 V to 1.13 V, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and supplied by Intel.

Key Features

• Core Capacity — 300,000 logic elements to implement complex programmable logic and custom architectures.
• On-chip Memory — Approximately 17.36 Mbits of embedded RAM for buffering, FIFOs, and local storage.
• I/O Density — 544 user I/Os to support wide buses, parallel interfaces, and multi-channel connectivity.
• Power Supply — Core voltage supply range of 1.07 V to 1.13 V to match system power rails and design requirements.
• Package & Mounting — 1152-BBGA (1152-FBGA, 35×35) with exposed pad; surface-mount for standard PCB assembly processes.
• Commercial Grade & Temperature — Rated for commercial operation from 0 °C to 85 °C.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic — Use the large logic element count to implement complex state machines, protocol engines, and custom datapaths.
• Memory-intensive designs — Embedded RAM capacity supports buffering, packet queues, and on-chip data processing.
• Dense I/O interfacing — 544 I/Os enable wide parallel buses, multi-channel sensor or I/O aggregation, and rich peripheral connectivity.

Unique Advantages

• Substantial logic and memory in one device: Combines 300,000 logic elements with ~17.36 Mbits of RAM to reduce the need for external logic and memory ICs.
• High I/O capacity: 544 user I/Os simplify board-level routing for multi-channel and high-pin-count interfaces.
• Controlled power envelope: Narrow core voltage range (1.07 V–1.13 V) helps simplify power-supply design and margin planning.
• Commercial-temperature qualification: Rated for 0 °C to 85 °C operation for typical industrial and commercial deployments.
• Surface-mount BBGA package: 1152-BBGA with exposed pad supports compact PCB layouts and thermal management practices.

Why Choose 5AGXFB1H6F35C6N?

The 5AGXFB1H6F35C6N Arria V GX FPGA targets designs that require a blend of high logic density, significant on-chip memory, and broad I/O connectivity within a commercial temperature range. Its combination of 300,000 logic elements, roughly 17.36 Mbits of embedded RAM, and 544 I/Os provides a versatile hardware foundation for advanced programmable solutions.

As an Intel device provided in a 1152-BBGA exposed-pad package and backed by Arria V device documentation, it delivers documented electrical and configuration characteristics for system integration, power budgeting, and thermal planning.

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