5AGXFB3H4F35C4N

The 5AGXFB3H4F35C4N is an Arria V GX field programmable gate array (FPGA) IC designed for board-level integration where large programmable logic capacity and extensive I/O are required. The device provides 362,000 logic elements and approximately 19.8 Mbits of embedded RAM, packaged in a 1152-BBGA FCBGA with exposed pad for surface-mount assembly.

With a 544-pin I/O count, a tightly specified core voltage range of 1.07 V to 1.13 V, and a commercial operating temperature range of 0 °C to 85 °C, this FPGA is suited to applications that demand high logic density, substantial on-chip memory, and dense external connectivity.

Key Features

• Core Logic — 362,000 logic elements provide a large fabric for implementing complex digital designs and programmable logic functions.
• Embedded Memory — Approximately 19.8 Mbits of on-chip RAM for buffers, FIFOs, and local data storage within the programmable fabric.
• I/O Capacity — 544 general-purpose I/Os to support extensive peripheral interfacing and multi-channel connectivity.
• Package — 1152-BBGA, FCBGA exposed pad package (supplier device package: 1152-FBGA, 35×35) optimized for compact, high-density board layouts.
• Power — Core voltage supply specified between 1.07 V and 1.13 V to match system power architectures requiring narrow core-voltage tolerance.
• Mounting & Grade — Surface-mount device in a commercial-grade offering with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-density digital logic — Use the 362,000 logic elements and embedded RAM to implement large-scale FPGA designs requiring substantial programmable resources.
• Multi-channel I/O systems — 544 I/Os enable direct interfacing to numerous peripherals, sensors, and bus interfaces on a single device.
• Compact board-level integration — The 1152-BBGA (35×35) package with exposed pad supports compact PCB footprints and surface-mount assembly.

Unique Advantages

• Large programmable fabric: 362,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing component count and BOM complexity.
• Substantial on-chip memory: Approximately 19.8 Mbits of embedded RAM supports local buffering and data processing without relying solely on external memory.
• Extensive I/O headroom: 544 I/Os provide flexibility to connect many peripherals or interfaces directly to the FPGA fabric.
• Compact, manufacturable package: 1152-BBGA FCBGA with exposed pad is suitable for dense board layouts and standard surface-mount production flows.
• Controlled core-voltage range: The specified 1.07 V to 1.13 V supply window helps ensure predictable power integration into regulated system designs.
• RoHS compliant: Supports lead-free assembly and environmental compliance requirements.

Why Choose 5AGXFB3H4F35C4N?

The 5AGXFB3H4F35C4N Arria V GX FPGA combines a substantial logic element count with nearly 20 Mbits of embedded RAM and a high I/O density to address designs that require significant on-chip resources and flexible interfacing. Packaged in a compact 1152-BBGA with exposed pad and intended for surface-mount assembly, it is positioned for board designs that need large programmable capacity in a space-efficient form factor.

This device is well suited to engineering teams and procurement looking for a commercial-grade FPGA offering predictable supply voltage requirements and a broad complement of I/Os, delivering scalable integration and long-term design continuity within the specified operating temperature and electrical limits.

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