5AGXFB3H4F35C5G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA

Quantity 400 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXFB3H4F35C5G – Arria V GX FPGA, 362,000 logic elements, approximately 19.8 Mbits RAM, 544 I/Os, 1152‑BBGA

The 5AGXFB3H4F35C5G is an Arria V GX field‑programmable gate array (FPGA) in a 1152‑BBGA FCBGA package. It provides high logic capacity and substantial on‑chip memory for complex, board‑level programmable logic implementations.

Designed for commercial temperature applications, this device combines a large logic element count, extensive I/O, and a defined core supply voltage range to support dense, deterministic hardware designs.

Key Features

  • High logic density  362,000 logic elements provide significant programmable logic capacity for complex designs.
  • Embedded memory  Approximately 19.8 Mbits of on‑chip RAM to support large buffering, state storage, and memory‑intensive functions without immediate reliance on external memory.
  • Extensive I/O  Up to 544 user I/Os to accommodate high‑pin‑count interfaces and multiple parallel buses.
  • Core voltage specification  Defined supply range from 1.07 V to 1.13 V for predictable power budgeting and core domain planning.
  • Commercial temperature grade  Rated for operation from 0°C to 85°C for mainstream commercial deployments.
  • Package and mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA, FC (35×35). Surface‑mount mounting type supports compact PCB integration.
  • RoHS compliant  Device meets RoHS environmental requirements.

Typical Applications

  • High‑density I/O systems  Deploy where up to 544 I/Os are required for parallel interfaces, sensor arrays, or multi‑channel connectivity.
  • Memory‑intensive FPGA designs  Use the approximately 19.8 Mbits of embedded RAM for buffering, packet staging, and on‑chip data processing.
  • Complex programmable logic  Leverage 362,000 logic elements for large state machines, custom datapaths, and integrated control logic.
  • Compact board‑level solutions  1152‑BBGA FCBGA packaging and surface‑mount mounting enable dense board layouts and space‑constrained designs.

Unique Advantages

  • Large programmable capacity: 362,000 logic elements enable consolidation of multiple functions onto a single device, reducing system complexity.
  • Significant on‑chip memory: Approximately 19.8 Mbits of embedded RAM lowers dependency on external memory for many common buffering and streaming tasks.
  • Broad connectivity: 544 I/Os support extensive peripheral and bus interfacing with fewer external components.
  • Defined power domain: A tight core voltage window (1.07 V–1.13 V) simplifies power supply design and margin planning.
  • Commercial temperature suitability: Rated 0°C–85°C for reliable operation across standard commercial environments.
  • Surface‑mount FCBGA packaging: 1152‑BBGA (35×35) offers a balance of I/O density and board integration for compact systems.

Why Choose 5AGXFB3H4F35C5G?

The 5AGXFB3H4F35C5G Arria V GX FPGA is positioned for designs that require substantial programmable logic, meaningful on‑chip memory capacity, and broad I/O connectivity in a compact surface‑mount package. Its specified core voltage range and commercial temperature rating provide predictable design parameters for mainstream embedded and board‑level applications.

Choose this device when you need to consolidate complex logic and memory functions on a single programmable device while maintaining a high I/O count and compact package footprint. Detailed device characteristics are documented in the device datasheet to support hardware integration and validation.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead‑time information for the 5AGXFB3H4F35C5G Arria V GX FPGA.

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