5AGXFB3H4F35I3G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 322 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.12 V - 1.18 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXFB3H4F35I3G – Arria V GX Field Programmable Gate Array (FPGA), 544 I/Os
The 5AGXFB3H4F35I3G is an Arria V GX field programmable gate array (FPGA) from Intel, offered in an industrial-grade specification. It delivers high-density programmable logic with 362,000 logic elements and approximately 19.8 Mbits of embedded on-chip RAM.
Designed for surface-mount PCB integration in a 1152-BBGA FCBGA exposed-pad package, this device provides 544 user I/Os and operates across a core supply range of 1.12 V to 1.18 V with an operating temperature range of −40 °C to 100 °C.
Key Features
- High-density logic fabric — 362,000 logic elements to implement complex programmable logic and functions.
- On-chip memory — Approximately 19.8 Mbits of embedded RAM for buffering, state storage, and on-chip data structures.
- Extensive I/O — 544 I/O pins to support broad system connectivity and parallel interfaces.
- Power and core supply — Core voltage operation between 1.12 V and 1.18 V for predictable power planning.
- Industrial temperature range — Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
- Package and mounting — 1152-BBGA FCBGA exposed pad (supplier package: 1152-FBGA 35×35) for surface-mount assembly and thermal management.
- Environmental compliance — RoHS-compliant construction.
Unique Advantages
- High integration density: 362,000 logic elements enable consolidation of complex logic into a single programmable device, simplifying board-level partitioning.
- Substantial on-chip RAM: Approximately 19.8 Mbits of embedded memory reduces reliance on external memory for many buffering and stateful functions.
- Large I/O capacity: 544 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and parallel channels without additional devices.
- Industrial thermal capability: −40 °C to 100 °C rating supports deployment in industrial environments and temperature-variable installations.
- Robust packaging for PCB integration: 1152-BBGA FCBGA with exposed pad and surface-mount mounting supports thermal dissipation and compact board layouts.
- Regulatory readiness: RoHS compliance supports environmentally conscious designs and regulatory requirements.
Why Choose 5AGXFB3H4F35I3G?
The 5AGXFB3H4F35I3G combines a high logic-element count, significant embedded memory, and a large number of I/Os in an industrial-grade Arria V GX FPGA, packaged for surface-mount deployment. These attributes make it well suited for designs that require substantial on-chip programmable resources and robust thermal/operating-range characteristics.
Backed by Intel's Arria V family lineage and documentation, this device provides a scalable building block for systems that need dense programmable logic, extensive I/O, and industrial temperature performance.
Request a quote or submit an inquiry specifying part number 5AGXFB3H4F35I3G and your required quantity to receive pricing and availability information.

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