5AGXFB3H4F35I3G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad

Quantity 322 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.12 V - 1.18 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXFB3H4F35I3G – Arria V GX Field Programmable Gate Array (FPGA), 544 I/Os

The 5AGXFB3H4F35I3G is an Arria V GX field programmable gate array (FPGA) from Intel, offered in an industrial-grade specification. It delivers high-density programmable logic with 362,000 logic elements and approximately 19.8 Mbits of embedded on-chip RAM.

Designed for surface-mount PCB integration in a 1152-BBGA FCBGA exposed-pad package, this device provides 544 user I/Os and operates across a core supply range of 1.12 V to 1.18 V with an operating temperature range of −40 °C to 100 °C.

Key Features

  • High-density logic fabric — 362,000 logic elements to implement complex programmable logic and functions.
  • On-chip memory — Approximately 19.8 Mbits of embedded RAM for buffering, state storage, and on-chip data structures.
  • Extensive I/O — 544 I/O pins to support broad system connectivity and parallel interfaces.
  • Power and core supply — Core voltage operation between 1.12 V and 1.18 V for predictable power planning.
  • Industrial temperature range — Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Package and mounting — 1152-BBGA FCBGA exposed pad (supplier package: 1152-FBGA 35×35) for surface-mount assembly and thermal management.
  • Environmental compliance — RoHS-compliant construction.

Unique Advantages

  • High integration density: 362,000 logic elements enable consolidation of complex logic into a single programmable device, simplifying board-level partitioning.
  • Substantial on-chip RAM: Approximately 19.8 Mbits of embedded memory reduces reliance on external memory for many buffering and stateful functions.
  • Large I/O capacity: 544 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and parallel channels without additional devices.
  • Industrial thermal capability: −40 °C to 100 °C rating supports deployment in industrial environments and temperature-variable installations.
  • Robust packaging for PCB integration: 1152-BBGA FCBGA with exposed pad and surface-mount mounting supports thermal dissipation and compact board layouts.
  • Regulatory readiness: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose 5AGXFB3H4F35I3G?

The 5AGXFB3H4F35I3G combines a high logic-element count, significant embedded memory, and a large number of I/Os in an industrial-grade Arria V GX FPGA, packaged for surface-mount deployment. These attributes make it well suited for designs that require substantial on-chip programmable resources and robust thermal/operating-range characteristics.

Backed by Intel's Arria V family lineage and documentation, this device provides a scalable building block for systems that need dense programmable logic, extensive I/O, and industrial temperature performance.

Request a quote or submit an inquiry specifying part number 5AGXFB3H4F35I3G and your required quantity to receive pricing and availability information.

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