5AGXFB3H4F35I5

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad

Quantity 752 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXFB3H4F35I5 – Arria V GX FPGA, 1152-BBGA Exposed Pad

The 5AGXFB3H4F35I5 is an Arria V GX Field Programmable Gate Array (FPGA) IC offering a high-density reprogrammable logic fabric for industrial applications. It combines 362,000 logic elements with substantial on-chip memory and a large I/O complement to support complex, I/O‑intensive designs.

Designed for surface-mount assembly in a 1152-BBGA exposed-pad package, this industrial-grade device operates across a 1.07 V to 1.13 V core supply window and an ambient range of –40 °C to 100 °C, providing a balance of performance, integration density, and environmental robustness.

Key Features

  • Logic Capacity  362,000 logic elements to implement complex digital functions and large-scale programmable logic.
  • Embedded Memory  Approximately 19.8 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
  • I/O Density  544 user I/O pins to support extensive peripheral interfacing and multi-channel system architectures.
  • Package and Mounting  1152-BBGA, FCBGA exposed pad package (supplier package: 1152-FBGA (35×35)) with surface-mount mounting for standard PCB assembly flows.
  • Power and Core Supply  Specified core voltage range of 1.07 V to 1.13 V for predictable power planning and supply design.
  • Industrial Temperature Range  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Standards Compliance  RoHS compliant, meeting common environmental and materials requirements.
  • Documented Family Specifications  Datasheet coverage includes electrical characteristics, switching and transceiver performance, configuration timing, and I/O timing for Arria V devices.

Typical Applications

  • Industrial Control and Automation  High logic capacity and industrial temperature rating enable complex control algorithms, deterministic I/O, and protocol bridging in factory and process automation.
  • Data and Signal Processing  Large on-chip RAM and extensive logic resources support streaming data buffering, packet processing, and custom signal-processing pipelines.
  • High‑I/O System Interfaces  544 I/Os facilitate dense peripheral connectivity, multi‑channel sensor aggregation, and board‑level I/O expansion.

Unique Advantages

  • High integration density: 362,000 logic elements reduce external logic and simplify system architecture by consolidating functions on a single device.
  • Substantial embedded memory: Approximately 19.8 Mbits of on‑chip RAM helps minimize external memory requirements and lowers BOM complexity.
  • Robust industrial operation: –40 °C to 100 °C rating supports deployment in harsh or temperature‑varying environments.
  • Large I/O complement: 544 I/Os provide flexibility for multiple interfaces and parallel data paths without extensive board redesign.
  • Thermally aware package: Exposed‑pad 1152‑BBGA package supports heat dissipation strategies required by dense, high‑performance designs.
  • Regulatory compliance: RoHS compliance assists with environmental requirements and global manufacturing acceptance.

Why Choose 5AGXFB3H4F35I5?

The 5AGXFB3H4F35I5 Arria V GX FPGA delivers a compelling mix of logic density, embedded memory, and I/O capacity in an industrial-grade package. It is suited for system designers who need large-scale programmable logic and significant on‑chip resources packaged for surface-mount production and operation across a wide temperature range.

With detailed datasheet coverage of electrical, switching, transceiver, and configuration specifications, this device supports informed design decisions and predictable integration into complex systems that demand high integration and environmental robustness.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 5AGXFB3H4F35I5 into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up