5AGXFB3H4F35I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 1,085 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXFB3H4F35I5N – Arria V GX Field Programmable Gate Array (1152-BBGA, Industrial)
The 5AGXFB3H4F35I5N is an Arria V GX field programmable gate array (FPGA) in an industrial-grade, surface-mount FCBGA package with an exposed pad. It integrates a large programmable fabric with substantial embedded memory and a high I/O count, supporting complex, high-density logic implementations.
Designed for applications that require significant on-chip logic capacity, abundant I/O, and industrial temperature operation, this device offers a balance of logic resources, memory, and system-level integration for demanding embedded and industrial designs.
Key Features
- Logic Capacity — Provides 362,000 logic elements for implementing large-scale, high-complexity digital designs.
- Embedded Memory — Includes approximately 19.8 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
- High I/O Count — 544 user I/O pins to support broad peripheral and interface requirements.
- Package and Mounting — Supplied in a 1152-BBGA (FCBGA exposed pad) package; supplier package listed as 1152-FBGA (35×35), intended for surface-mount assembly.
- Industrial Temperature Grade — Rated for operation from –40°C to 100°C for reliable use in temperature-extreme environments.
- Core Voltage — Narrow recommended supply range of 1.07 V to 1.13 V for core power delivery and system design planning.
- Standards Compliance — RoHS compliant.
Typical Applications
- Industrial Control & Automation — Industrial temperature rating and robust logic resources support control logic, motor drives, and automation subsystems.
- High‑Density Embedded Systems — Large logic element count and on-chip memory enable consolidation of complex functions onto a single FPGA.
- Data-Intensive Interfaces — High I/O count accommodates multichannel sensor arrays, parallel interfaces, and extensive peripheral connectivity.
- Prototyping & Evaluation — Suitable for developers implementing and validating large FPGA-based designs that require significant logic and memory resources.
Unique Advantages
- Substantial Logic Resources: 362,000 logic elements give designers headroom for complex state machines, datapaths, and custom accelerators.
- Significant On‑Chip Memory: Approximately 19.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Broad I/O Support: 544 I/O pins provide flexibility to interface with numerous peripherals and subsystems without additional multiplexing hardware.
- Industrial Reliability: –40°C to 100°C operating range and industrial grade enable deployment in temperature-challenging environments.
- Compact System Footprint: 1152-BBGA FCBGA exposed‑pad package (supplier package: 1152-FBGA, 35×35) supports high-density board designs with surface-mount assembly.
- Predictable Core Powering: Defined core voltage range (1.07 V–1.13 V) helps streamline power-supply design and validation.
Why Choose 5AGXFB3H4F35I5N?
The 5AGXFB3H4F35I5N Arria V GX FPGA combines a very large logic fabric, nearly 20 Mbits of embedded RAM, and a high pin-count package in an industrial-grade device. This combination makes it well suited for engineers and system designers who need to implement complex, high-density logic and extensive I/O in temperature-demanding environments.
Choosing this part supports consolidation of multi-function systems onto a single programmable device, helps reduce external component count, and provides a stable specification set for long-term industrial deployments.
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