5AGXFB3H4F35I3NGA

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA

Quantity 264 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.12 V - 1.18 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXFB3H4F35I3NGA – Arria V GX Field Programmable Gate Array (FPGA) IC, 544 I/O, 362,000 logic elements

The 5AGXFB3H4F35I3NGA is an industrial-grade Arria V GX FPGA offering a large programmable fabric and extensive on-chip memory for complex digital designs. This device provides 362,000 logic elements and approximately 19.82 Mbits of embedded RAM, combined with 544 user I/O pins and a 1152-ball FCBGA package for high-density board integration.

Targeted at applications that require high logic capacity, substantial embedded memory, and a wide operating range, the device is specified for a 1.12 V to 1.18 V core supply and an operating temperature range of −40 °C to 100 °C. The part is RoHS compliant.

Key Features

  • Logic Capacity 362,000 logic elements provide a large programmable fabric for complex logic, state machines, and custom processing pipelines.
  • Embedded Memory Approximately 19.82 Mbits of on-chip RAM to support buffering, lookup tables, and data-intensive processing tasks.
  • High I/O Count 544 user I/O pins enable dense external interfacing for parallel buses, multi-lane interfaces, and broad sensor/ peripheral connectivity.
  • Industrial Grade and Temperature Range Rated for industrial operation with an operating temperature range from −40 °C to 100 °C for use in demanding environments.
  • Power and Voltage Core voltage supply specified between 1.12 V and 1.18 V to match system power-rail planning and power-management design.
  • Package and Mounting 1152-ball FCBGA (1152-BBGA) package, supplier package listed as 1152-FBGA, FC (35×35), designed for surface-mount assembly.
  • Compliance RoHS compliant, supporting regulatory and environmental requirements for electronic assemblies.

Typical Applications

  • Data Processing and Acceleration Large logic capacity and on-chip RAM make the device suitable for custom data-path acceleration and complex processing blocks.
  • I/O-Intensive Systems The 544 I/O pins enable dense external connectivity for multi-channel interfaces, parallel buses, and extensive sensor arrays.
  • Industrial Controls and Instrumentation Industrial-grade temperature rating and robust package make the device appropriate for automation, control systems, and test equipment.

Unique Advantages

  • Large Programmable Fabric: 362,000 logic elements provide ample capacity to implement sizable custom logic and system-on-chip functions without extensive external ASICs.
  • Significant On-Chip Memory: Approximately 19.82 Mbits of embedded RAM reduces reliance on external memory for buffering and accelerates data paths.
  • High Pin Count for System Integration: 544 I/O pins allow direct connection to multiple peripherals and high-bandwidth external interfaces, simplifying board-level routing.
  • Industrial Temperature Support: Specified operation from −40 °C to 100 °C supports deployment in temperature-demanding environments.
  • Compact, Surface-Mount Package: The 1152-ball FCBGA package enables high-density PCB designs while maintaining manufacturability with surface-mount processes.
  • Regulatory Compliance: RoHS compliance supports environmental and end-product regulatory requirements.

Why Choose 5AGXFB3H4F35I3NGA?

The 5AGXFB3H4F35I3NGA Arria V GX FPGA combines high logic density, substantial embedded RAM, and a large I/O count in an industrial-grade, surface-mount FCBGA package. It is well suited for designers needing extensive programmable resources and on-chip memory while maintaining operation across a broad temperature range. Engineers and procurement teams seeking a scalable FPGA building block for complex digital systems can leverage these measured specifications to streamline board-level integration and system architecture.

Request a quote or submit your specification inquiry to obtain pricing, availability, and more detailed ordering information for the 5AGXFB3H4F35I3NGA.

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