5AGXFB3H4F35I3N

The 5AGXFB3H4F35I3N is an Intel Arria V GX field programmable gate array (FPGA) offered in an industrial grade package. It provides a high-density programmable-logic fabric combined with substantial embedded memory and a large I/O footprint for designs that require on-chip logic capacity and interface density.

Key capabilities exposed in the device data include 362,000 logic elements, approximately 19.8 Mbits of embedded RAM, 544 user I/O pins, and a core voltage supply range of 1.12–1.18 V, all in a 1152‑BBGA exposed‑pad package rated for surface-mount assembly and operation from −40 °C to 100 °C.

Key Features

• Programmable Logic Capacity  362,000 logic elements provide substantial on-chip resources for implementing complex digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 19.8 Mbits of on-chip RAM for buffering, LUT-based storage, and memory-intensive algorithms.
• High I/O Density  544 user I/O pins accommodate multi-channel interfaces, wide buses, and extensive peripheral connectivity.
• Power and Core Supply  Core voltage supply range of 1.12–1.18 V to match Arria V GX device requirements.
• Package and Mounting  1152‑BBGA, FCBGA exposed pad (supplier package: 1152‑FBGA, 35×35) designed for surface-mount PCB assembly.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C for industrial applications.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital processing: Use the 362,000 logic elements and ~19.8 Mbits of RAM to implement complex signal processing, packet processing, or custom compute blocks.
• Multi-channel I/O systems: 544 I/O pins enable aggregation of multiple serial or parallel interfaces and support for wide data buses and external peripherals.
• Industrial control and instrumentation: Industrial temperature rating and surface-mount package suitability make the device appropriate for embedded control, monitoring, and automation equipment.

Unique Advantages

• Large programmable fabric: 362,000 logic elements provide headroom for feature-rich designs and parallel hardware implementations, reducing reliance on external ASICs.
• Significant on-chip memory: Approximately 19.8 Mbits of embedded RAM helps minimize external memory dependence and supports high-throughput buffering and state storage.
• Extensive I/O capability: 544 user I/O pins simplify board-level integration for systems with many sensors, transceivers, or peripherals.
• Industry-grade thermal range: −40 °C to 100 °C operation supports a wide range of industrial environments and deployment scenarios.
• Compact, assembly-ready package: 1152‑BBGA (1152‑FBGA, 35×35) with exposed pad enables dense PCB layouts while supporting thermal and mechanical mounting needs.
• Standards-aligned compliance: RoHS compliance aligns the device with common environmental and manufacturing requirements.

Why Choose 5AGXFB3H4F35I3N?

5AGXFB3H4F35I3N positions itself as a high-capacity, industrial-grade member of the Arria V GX family, combining substantial logic resources, embedded memory, and an extensive I/O complement in a compact BGA package. These characteristics make it suitable for engineers building feature-rich, interface-dense systems that must operate across industrial temperature ranges.

The device is provided with Arria V device documentation and electrical specifications to support design, configuration, and integration into production systems, enabling predictable performance when matched to the stated voltage and thermal requirements.

Request a quote or submit an inquiry to evaluate 5AGXFB3H4F35I3N for your next programmable-logic design project.