5AGXFB3H4F35I3

The 5AGXFB3H4F35I3 is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package. It combines high logic capacity, substantial on‑chip memory, and a large number of I/O to address designs that require dense programmable logic and extensive interfacing.

With 547,520 logic elements, approximately 2.15 Mbits of embedded memory, and 544 I/O pins, this industrial‑grade FPGA targets systems that need scalable programmable logic, broad connectivity, and operation across an extended temperature range.

Key Features

• Core Logic  547,520 logic elements provide a large programmable fabric for implementing complex digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 2.15 Mbits of on‑chip RAM for buffering, lookup tables, and state storage directly within the FPGA fabric.
• I/O Capacity  544 general I/O pins support extensive external interfacing for multi‑lane data paths, peripherals, and system control signals.
• Power Supply  Core voltage supply range of 1.12 V to 1.18 V to meet the device’s specified operating requirements.
• Package and Mounting  1152‑BBGA (FCBGA) package with supplier device package specified as 1152‑FBGA, FC (35 × 35 mm); designed for surface‑mount PCB assembly.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in thermally demanding environments.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead‑free assemblies.

Typical Applications

• Industrial Control and Automation  Use the high logic capacity and industrial temperature range to implement control algorithms, I/O aggregation, and interface bridging in factory and process automation systems.
• High‑density Signal Processing  Leverage the large number of logic elements and on‑chip memory for buffering and pipeline stages in digital signal processing and real‑time data manipulation tasks.
• Interface and Protocol Bridging  The 544 I/O pins enable complex interfacing and protocol conversion between multiple buses, sensors, and peripheral devices.

Unique Advantages

• High Logic Density: 547,520 logic elements enable implementation of large, complex designs without immediate need for multi‑chip partitioning.
• Substantial Embedded Memory: Approximately 2.15 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and state storage needs.
• Extensive I/O Count: 544 I/O pins provide flexibility for multi‑lane interfaces and rich peripheral connectivity in compact system designs.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to support deployment in harsh or temperature‑variable environments.
• Compact FCBGA Packaging: 1152‑FBGA, 35 × 35 mm package supports high pin count in a board‑mountable form factor for space‑constrained applications.
• RoHS Compliant: Meets lead‑free assembly requirements for compliant product builds.

Why Choose 5AGXFB3H4F35I3?

The 5AGXFB3H4F35I3 positions itself as a high‑capacity, industrial‑grade FPGA choice for designs that demand large programmable logic resources, significant on‑chip memory, and broad external connectivity. Its combination of 547,520 logic elements, approximately 2.15 Mbits of embedded RAM, and 544 I/O pins makes it suitable for complex control, signal processing, and interface consolidation tasks.

Backed by Intel as the manufacturer and supplied in a 1152‑BBGA (35 × 35 mm) FCBGA package, this device provides a balance of integration and rugged operating range that supports long‑term deployment in industrial systems and high‑density embedded platforms.

Request a quote today to discuss availability, pricing, and how the 5AGXFB3H4F35I3 can meet the requirements of your next design.