5AGXFB3H4F35I5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 597 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXFB3H4F35I5G – Arria V GX FPGA, 544 I/O, approx. 19.82 Mbits RAM, 362,000 logic elements, 1152‑BBGA
The 5AGXFB3H4F35I5G is an Arria V GX Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade embedded logic applications. This device combines a large logic fabric with substantial on‑chip memory and a high I/O count, delivered in a 1152‑ball BGA package with an exposed pad for system thermal considerations.
Targeted at designs that require extensive programmable logic, on‑chip RAM, and many external interfaces, this Arria V GX device provides a platform for complex digital signal processing, interface aggregation, and control implementations while operating across an industrial temperature range.
Key Features
- Logic Fabric Provides 362,000 logic elements to implement complex, high‑density digital designs.
- Embedded Memory Approximately 19.82 Mbits of on‑chip RAM to support buffering, lookup tables, and data‑intensive processing.
- High I/O Count 544 user I/Os to accommodate many parallel interfaces, external peripherals, and multi‑lane I/O requirements.
- Package & Mounting 1152‑BBGA (FCBGA exposed pad) package; supplier device package specified as 1152‑FBGA (35×35). Surface mount device for PCB assembly.
- Power Core voltage supply range from 1.07 V to 1.13 V for the device core.
- Industrial Temperature Rating Qualified for operation from −40 °C to 100 °C, suitable for industrial environments.
- Regulatory RoHS compliant.
Typical Applications
- High‑density digital processing Large logic capacity and substantial embedded RAM make this device suitable for complex processing pipelines and custom accelerators.
- High‑channel I/O systems A high I/O count supports multi‑interface aggregation, parallel sensors, and multi‑lane connectivity.
- Industrial control and automation Industrial temperature rating and robust package options allow deployment in factory automation and control equipment.
- System integration and prototyping A versatile logic and memory resource set supports integration of custom peripherals and rapid hardware iteration.
Unique Advantages
- Large, program‑able logic capacity: 362,000 logic elements enable implementation of extensive custom digital functions on a single device.
- Substantial on‑chip memory: Approximately 19.82 Mbits of RAM reduces dependence on external memory for many buffering and data‑processing tasks.
- Extensive external connectivity: 544 I/Os provide flexibility for complex board‑level interfaces without immediate need for external I/O expander components.
- Industrial readiness: Operation from −40 °C to 100 °C supports deployment in harsher environments common to industrial applications.
- Compact, high‑pin package: 1152‑ball BGA with exposed pad offers a high pin count in a manageable PCB footprint and provisions for thermal management.
- RoHS compliant: Meets lead‑free environmental requirements for modern electronic systems.
Why Choose 5AGXFB3H4F35I5G?
The 5AGXFB3H4F35I5G Arria V GX FPGA delivers a combination of large logic capacity, meaningful on‑chip memory, and a high number of I/Os in a single industrial‑grade device. Its electrical supply range and package choices align with designs that need dense programmable logic, substantial embedded storage, and broad peripheral connectivity while meeting environmental and mounting expectations for surface‑mount production.
This device is well suited for engineering teams designing complex digital systems that require scalability and integration—reducing board‑level component count and centralizing logic and memory resources on a single FPGA. Its industrial temperature rating and RoHS compliance add practical value for long‑term deployments and regulatory alignment.
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