5AGXFB3H4F35I5NAB

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA

Quantity 918 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXFB3H4F35I5NAB – Arria V GX FPGA, 362,000 logic elements, 544 I/Os

The 5AGXFB3H4F35I5NAB is an Intel Arria V GX field programmable gate array (FPGA) in an industrial-grade package. It provides a high-density programmable fabric with 362,000 logic elements, on-chip embedded memory, and an extensive I/O complement for complex, reconfigurable system designs.

Designed for surface-mount deployment, this device supports a core supply range of 1.07 V to 1.13 V and an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-demanding applications that require robust, vendor-backed FPGA silicon.

Key Features

  • High-density programmable fabric — 362,000 logic elements enable implementation of large-scale, reconfigurable logic and custom processing pipelines.
  • Substantial embedded memory — Total on-chip RAM of 19,822,592 bits (approximately 19.8 Mbits) for buffering, FIFOs, and on-chip data storage.
  • Extensive I/O capability — 544 user I/Os to accommodate numerous interfaces and parallel connections to external devices.
  • Industrial-grade operation — Device grade listed as Industrial and an operating temperature range of −40 °C to 100 °C for harsh-environment suitability.
  • Controlled core power — Core voltage supply specified between 1.07 V and 1.13 V to support stable core operation.
  • Package and mounting — Surface mount device in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA, FC (35×35).
  • Standards compliance — RoHS compliant for environmental and manufacturing conformity.

Typical Applications

  • Reconfigurable logic and acceleration — Implement custom logic blocks, accelerators, or datapath pipelines using the device's large logic element count.
  • I/O-dense systems — Support designs that require many external interfaces or parallel I/O with 544 available I/Os.
  • Memory-intensive designs — Use approximately 19.8 Mbits of embedded memory for buffering, packet storage, or local data processing.
  • Industrial-temperature deployments — Deploy in systems that require operation across −40 °C to 100 °C, leveraging the industrial grade rating.

Unique Advantages

  • High logic capacity: 362,000 logic elements provide the fabric to consolidate multiple functions into a single FPGA, reducing system complexity.
  • Significant on-chip RAM: Approximately 19.8 Mbits of embedded memory reduces reliance on external memory for many buffering and temporary-storage needs.
  • Large I/O footprint: 544 I/Os enable flexible interface options and parallel connectivity for high-throughput applications.
  • Industrial robustness: Specified industrial grade and extended temperature range support reliable operation in demanding environments.
  • Standard surface-mount package: 1152-BBGA FCBGA package and 35×35 supplier footprint simplify board-level integration for automated assembly.
  • RoHS compliant: Meets common environmental compliance requirements for manufacturing and distribution.

Why Choose 5AGXFB3H4F35I5NAB?

The 5AGXFB3H4F35I5NAB Arria V GX FPGA combines a high-density logic fabric, substantial on-chip memory, and a large number of I/Os in a qualified industrial package. These characteristics make it well suited for designs that require extensive reconfigurable logic, local memory resources, and numerous external interfaces while operating across an extended temperature range.

With controlled core voltage requirements and surface-mount BBGA packaging, this device supports integration into production systems that prioritize reliability, scalability, and reduced board-level complexity. Choose this FPGA when your design demands a balance of logic capacity, embedded memory, and rugged operation.

Request a quote or submit a quote for part number 5AGXFB3H4F35I5NAB to obtain pricing and lead-time information for your project needs.

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