5AGXFB1H4F40I3G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 17358848 300000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,342 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.12 V - 1.18 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXFB1H4F40I3G – Arria V GX FPGA, 300,000 logic elements, 704 I/O
The 5AGXFB1H4F40I3G is an Intel Arria V GX field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It combines a high-density programmable fabric with substantial on-chip memory and a large I/O count to support complex, I/O‑intensive designs.
Designed and specified for industrial use, this device offers a core voltage supply range of 1.12 V to 1.18 V and an operating temperature range of −40 °C to 100 °C, making it suitable for systems that require robust operation across a wide temperature span.
Key Features
- Core Logic 300,000 logic elements provide a high-density programmable fabric for implementing complex digital functions and custom processing pipelines.
- Embedded Memory Approximately 17.36 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive logic blocks within the FPGA fabric.
- High I/O Count 704 I/O pins enable broad peripheral connectivity and multi-channel interfacing without external I/O expanders.
- Package & Mounting 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA, FC (40×40). Surface mount design for automated PCB assembly.
- Power Core voltage supply specified between 1.12 V and 1.18 V to match system power-rail planning and regulator selection.
- Industrial Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
- Compliance RoHS‑compliant to meet environmental and regulatory requirements for lead‑free assemblies.
Unique Advantages
- High-density programmable fabric: 300,000 logic elements enable integration of substantial custom logic and algorithm acceleration on a single device, reducing board-level complexity.
- Significant on-chip memory: Approximately 17.36 Mbits of embedded RAM minimize dependency on external memory for many buffering and temporary storage tasks.
- Extensive I/O capability: 704 I/O pins support connecting multiple high-speed peripherals and parallel interfaces directly to the FPGA.
- Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for designs that require extended temperature operation and environmental robustness.
- Compact BGA footprint: 1517‑BBGA FCBGA packaging allows high-pin-count integration in a compact form factor for space-constrained PCBs.
- Regulatory compatibility: RoHS compliance simplifies use in lead‑free manufacturing and global product shipments.
Why Choose 5AGXFB1H4F40I3G?
The 5AGXFB1H4F40I3G delivers a balanced combination of dense programmable logic, sizable on‑chip memory, and a large I/O complement in a compact FCBGA package. Its industrial grade specification and wide operating temperature range make it a dependable choice for applications that demand sustained performance across varied environmental conditions.
Manufactured by Intel as part of the Arria V family, this FPGA is positioned for designs that require substantial integration, minimized external components, and reliable operation. Its electrical and packaging specifications support straightforward power-rail planning and high‑density board layouts for long-term deployment.
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