5AGXMA1D4F31C5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 416 8666112 75000 896-BBGA, FCBGA |
|---|---|
| Quantity | 809 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 416 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3537 | Number of Logic Elements/Cells | 75000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 8666112 |
Overview of 5AGXMA1D4F31C5G – Arria V GX Field Programmable Gate Array (FPGA)
The 5AGXMA1D4F31C5G is an Arria V GX series Field Programmable Gate Array (FPGA) in a 896-BBGA FCBGA package, offered in a commercial grade. It integrates 75,000 logic elements and approximately 8.7 Mbits of on-chip RAM to support complex logic and memory-intensive designs. With 416 I/O pins, a compact 896‑FBGA (31×31) package and a tightly controlled core supply range, this device is suitable for demanding embedded and system-level applications that require significant logic density and flexible I/O.
Key Features
- Logic Capacity — 75,000 logic elements for implementing complex digital logic, state machines, and custom processing pipelines.
- Embedded Memory — Approximately 8.7 Mbits of total on-chip RAM to support buffering, FIFOs, and embedded data storage.
- I/O Density — 416 dedicated I/O pins to connect to high-pin-count interfaces and parallel buses.
- Package and Mounting — 896-BBGA, FCBGA package (supplier device package: 896-FBGA (31×31)) designed for surface-mount assembly.
- Power Supply — Core voltage supply specified between 1.07 V and 1.13 V to support predictable power provisioning and regulator selection.
- Operating Temperature — Commercial temperature rating from 0 °C to 85 °C for standard environment deployments.
- Regulatory — RoHS compliant, meeting common environmental packaging directives.
Unique Advantages
- High logic density: 75,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and interconnect complexity.
- Substantial embedded memory: Approximately 8.7 Mbits of on-chip RAM supports local buffering and latency-sensitive data paths without immediate external memory reliance.
- Extensive I/O: 416 I/O pins provide flexibility for complex interface mixes and parallel data buses, simplifying board-level routing for multi-channel designs.
- Compact, high-pin-count packaging: 896-FBGA (31×31) package balances pin count and board area for space-constrained system boards.
- Controlled core supply range: A narrow core voltage window (1.07 V–1.13 V) enables predictable power design and regulator selection for stable operation.
- Commercial-grade availability: Designed for standard commercial temperature environments (0 °C–85 °C) to match typical industrial and enterprise product lifecycles.
Why Choose 5AGXMA1D4F31C5G?
The 5AGXMA1D4F31C5G Arria V GX FPGA offers a strong balance of logic capacity, embedded memory, and I/O flexibility in a compact 896‑FBGA package, making it a practical choice for designs that need substantial on-chip resources without moving to larger packaging options. Its defined core voltage range and RoHS compliance facilitate predictable power architecture and regulatory alignment for commercial products. This part is well suited to engineering teams looking to integrate dense programmable logic and embedded memory into mid-to-high complexity systems while maintaining a compact board footprint.
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