5AGXMA1D4F27I5N

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 8666112 75000 672-BBGA, FCBGA

Quantity 551 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3537Number of Logic Elements/Cells75000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8666112

Overview of 5AGXMA1D4F27I5N – Arria V GX FPGA, 75,000 Logic Elements, 336 I/Os

The 5AGXMA1D4F27I5N is an Arria V GX field programmable gate array (FPGA) offered in an industrial grade. It provides a high-density logic fabric and substantial embedded memory in a compact 672-ball BGA package, targeting designs that require large logic capacity, extensive I/O, and operation across an extended temperature range.

Key on-chip resources include approximately 75,000 logic elements and roughly 8.66 Mbits of embedded RAM, with a supply voltage window of 1.07 V to 1.13 V and operating temperature range of −40 °C to 100 °C — making it suitable for robust, I/O- and memory-intensive industrial applications.

Key Features

  • Logic Fabric  Approximately 75,000 logic elements implemented across 3,537 logic array blocks (CLBs) for high-density programmable logic.
  • On-chip Memory  Total RAM bits: 8,666,112 — approximately 8.66 Mbits of embedded memory for buffering, packet handling, and local data storage.
  • I/O Capacity  336 user I/Os to support complex, multi-interface systems and high pin-count peripherals.
  • Power / Core Voltage  Specified core voltage supply range of 1.07 V to 1.13 V to support defined core power domains.
  • Package & Mounting  672-ball BGA (FCBGA) package; supplier device package listed as 672-FBGA (27 × 27); surface-mount mounting type for PCB assembly.
  • Industrial Grade Operation  Rated for industrial-grade operation with an operating temperature range from −40 °C to 100 °C.
  • RoHS Compliant  Meets RoHS environmental compliance requirements.

Typical Applications

  • Industrial Control Systems  Industrial-grade temperature rating and a high I/O count make this device appropriate for robust control, monitoring, and automation applications.
  • I/O-Intensive Interfaces  With 336 I/Os, the device supports designs that require multiple parallel interfaces, sensor arrays, or bridging between subsystems.
  • Embedded Processing & Data Buffering  Approximately 8.66 Mbits of on-chip RAM provide local storage for packet buffering, frame buffering, or intermediate data processing.
  • High-Density Logic Implementations  Around 75,000 logic elements enable implementation of complex state machines, custom accelerators, and glue logic within a single FPGA.

Unique Advantages

  • High Logic Density: Enables consolidation of complex digital functions with approximately 75,000 logic elements.
  • Substantial On-Chip Memory: Roughly 8.66 Mbits of embedded RAM reduces external memory dependency for many buffering and local storage needs.
  • Extensive I/O Resources: 336 I/Os support multi-channel interfaces and flexible system integration options.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compact BGA Package: 672-ball FCBGA (27 × 27) delivers dense pinout in a surface-mount form factor suitable for space-constrained PCBs.
  • Defined Core Supply Window: Narrow core voltage range (1.07 V–1.13 V) supports controlled core power management.

Why Choose 5AGXMA1D4F27I5N?

The 5AGXMA1D4F27I5N Arria V GX FPGA combines high logic capacity, considerable on-chip memory, and a large I/O complement in an industrial-grade package. Its specification set — including approximately 75,000 logic elements, about 8.66 Mbits of embedded RAM, 336 I/Os, and −40 °C to 100 °C operation — positions it for designs that demand dense programmable logic alongside robust environmental performance.

Backed by the Arria V device documentation, this device is suited to engineers and product teams developing industrial control, I/O-heavy, or embedded processing systems that benefit from integrated memory and a compact BGA package.

Request a quote or submit an inquiry to receive pricing and lead-time information for the 5AGXMA1D4F27I5N Arria V GX FPGA.

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