5AGXMA1D4F27I3N

The 5AGXMA1D4F27I3N is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel. It integrates approximately 75,000 logic elements and roughly 8.67 Mbits of on‑chip RAM to support dense, configurable logic and memory requirements. With 336 I/O pins and industrial grade temperature support, this device is suited for FPGA‑based designs that require a combination of logic density, embedded memory, and a compact BGA package.

Key Features

• Logic Capacity  Approximately 75,000 logic elements to implement complex programmable logic and custom datapaths.
• Embedded Memory  Approximately 8.67 Mbits of on‑chip RAM (total RAM bits: 8,666,112) for buffering, FIFOs, and storage of intermediate data.
• I/O Density  336 user I/O pins enabling broad peripheral interfacing and parallel I/O requirements.
• Voltage Supply  Core supply range: 1.12 V to 1.18 V to match platform power-rail requirements.
• Package & Mounting  672‑BBGA (FCBGA) package; supplier device package listed as 672‑FBGA (27×27). Surface mount construction for board‑level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting industrial environments and extended thermal ranges.
• Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.
• Documentation Coverage  Datasheet coverage includes electrical characteristics, switching characteristics, configuration specifications, and I/O timing for Arria V GX devices.

Typical Applications

• Industrial control and automation  Industrial‑grade operating range and dense logic/memory resources support control logic, protocol handling, and deterministic I/O interfacing.
• FPGA development and prototyping  Large logic element count and substantial on‑chip RAM make this device suitable for prototyping complex RTL designs and system integration tasks.
• High‑density I/O subsystems  336 I/O pins allow implementation of parallel interfaces, custom buses, and multiple peripheral connections on compact PCBs.

Unique Advantages

• Substantial configurable logic: The device’s approximately 75,000 logic elements enable implementation of large custom logic blocks and complex state machines without external glue logic.
• On‑chip memory capacity: Nearly 8.67 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage, simplifying board design.
• Robust I/O resources: 336 I/O pins provide flexibility for mixed parallel/serial interfacing and multiple peripheral connections in a single FPGA footprint.
• Industrial thermal rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature‑variable environments.
• Compact BGA packaging: 672‑ball FCBGA package (27×27) balances high pin count with a compact board footprint for space‑constrained designs.
• Standards‑oriented documentation: Detailed datasheet sections (electrical and switching characteristics, configuration timing, I/O timing) support accurate system integration and timing closure.

Why Choose 5AGXMA1D4F27I3N?

The 5AGXMA1D4F27I3N Arria V GX device combines substantial logic capacity and embedded memory with a high I/O count and industrial temperature rating, making it a practical choice for FPGA‑based subsystems where integration density and environmental robustness matter. Its 672‑BBGA package and defined core voltage range ease placement in compact, power‑managed designs.

This device is well suited to engineers and system designers looking for a scalable, well‑documented FPGA building block with verified electrical and configuration specifications for reliable system integration over the long term.

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