5AGXMA1D4F27I3G

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 8666112 75000 672-BBGA, FCBGA

Quantity 262 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.12 V - 1.18 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3537Number of Logic Elements/Cells75000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits8666112

Overview of 5AGXMA1D4F27I3G – Arria V GX Field Programmable Gate Array (FPGA) IC

The 5AGXMA1D4F27I3G is an Arria V GX family FPGA offering a high-capacity, programmable logic fabric tailored for designs that require large logic resources and dense I/O. This industrial-grade device integrates 75,000 logic elements, approximately 8.66 Mbits of embedded memory, and 336 general-purpose I/O pins in a 672-BBGA FCBGA package.

With an operating voltage range of 1.12 V to 1.18 V and a specified industrial temperature range from −40 °C to 100 °C, this device is intended for applications that need sustained operation across extended temperature environments while leveraging a mature Arria V device datasheet for electrical and configuration specifications.

Key Features

  • Core Logic  75,000 logic elements provide large-scale programmable fabric for complex custom logic and acceleration tasks.
  • Embedded Memory  Approximately 8.66 Mbits of on-chip RAM to support buffering, state storage, and data-path acceleration directly inside the FPGA.
  • I/O Density  336 I/O pins enable interfacing to multiple peripherals, buses, and high-pin-count connectors without external IO expanders.
  • Package & Mounting  672-BBGA (672-FBGA, 27×27) FCBGA package designed for surface-mount assembly to fit high-density board layouts.
  • Power  Core supply specified between 1.12 V and 1.18 V to meet the device’s electrical operating conditions.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for use in temperature-challenging deployments.
  • Standards Compliance  RoHS compliant for environmental regulatory requirements.

Typical Applications

  • High-density I/O systems  Use the 336 I/Os to connect diverse peripherals, multi-lane interfaces, and board-level bus fabrics while minimizing external logic.
  • On-chip buffering and data handling  Embedded memory (≈8.66 Mbits) supports local data storage for real-time processing and packet buffering tasks.
  • Industrial embedded systems  Industrial-grade temperature and supply specifications make the device suitable for deployments requiring robust thermal range and repeatable electrical operation.
  • Custom programmable logic  75,000 logic elements provide headroom for implementing large custom datapaths, control logic, and hardware accelerators.

Unique Advantages

  • Large programmable capacity: 75,000 logic elements enable complex designs and feature-rich implementations without immediate part upgrades.
  • Significant on-chip memory: Approximately 8.66 Mbits of embedded RAM reduces dependence on external memory for many buffering and working-set needs.
  • High I/O count: 336 I/Os support flexible interfacing and reduce the need for additional IO expansion hardware.
  • Industrial-ready thermal range: Specified operation from −40 °C to 100 °C supports extended-environment applications.
  • Dense, surface-mount packaging: 672-BBGA FCBGA package offers a compact footprint for high-density PCB designs.
  • Regulatory compliance: RoHS compliance simplifies environmental qualification for many programs.

Why Choose 5AGXMA1D4F27I3G?

The 5AGXMA1D4F27I3G delivers a balanced combination of logic capacity, embedded memory, and I/O density in an industrial-grade Arria V GX FPGA. It is well suited to engineers who need a high-density programmable fabric with on-chip resources and robust temperature specifications for sustained operation.

As part of the Arria V family, this device is supported by comprehensive electrical and configuration documentation, enabling detailed design planning and system integration for performance-focused applications.

Request a quote or submit a part inquiry to begin integrating the 5AGXMA1D4F27I3G into your next design.

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