5AGXMA1D4F27I3G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 336 8666112 75000 672-BBGA, FCBGA |
|---|---|
| Quantity | 262 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 336 | Voltage | 1.12 V - 1.18 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3537 | Number of Logic Elements/Cells | 75000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 8666112 |
Overview of 5AGXMA1D4F27I3G – Arria V GX Field Programmable Gate Array (FPGA) IC
The 5AGXMA1D4F27I3G is an Arria V GX family FPGA offering a high-capacity, programmable logic fabric tailored for designs that require large logic resources and dense I/O. This industrial-grade device integrates 75,000 logic elements, approximately 8.66 Mbits of embedded memory, and 336 general-purpose I/O pins in a 672-BBGA FCBGA package.
With an operating voltage range of 1.12 V to 1.18 V and a specified industrial temperature range from −40 °C to 100 °C, this device is intended for applications that need sustained operation across extended temperature environments while leveraging a mature Arria V device datasheet for electrical and configuration specifications.
Key Features
- Core Logic 75,000 logic elements provide large-scale programmable fabric for complex custom logic and acceleration tasks.
- Embedded Memory Approximately 8.66 Mbits of on-chip RAM to support buffering, state storage, and data-path acceleration directly inside the FPGA.
- I/O Density 336 I/O pins enable interfacing to multiple peripherals, buses, and high-pin-count connectors without external IO expanders.
- Package & Mounting 672-BBGA (672-FBGA, 27×27) FCBGA package designed for surface-mount assembly to fit high-density board layouts.
- Power Core supply specified between 1.12 V and 1.18 V to meet the device’s electrical operating conditions.
- Industrial Temperature Range Qualified for operation from −40 °C to 100 °C for use in temperature-challenging deployments.
- Standards Compliance RoHS compliant for environmental regulatory requirements.
Typical Applications
- High-density I/O systems Use the 336 I/Os to connect diverse peripherals, multi-lane interfaces, and board-level bus fabrics while minimizing external logic.
- On-chip buffering and data handling Embedded memory (≈8.66 Mbits) supports local data storage for real-time processing and packet buffering tasks.
- Industrial embedded systems Industrial-grade temperature and supply specifications make the device suitable for deployments requiring robust thermal range and repeatable electrical operation.
- Custom programmable logic 75,000 logic elements provide headroom for implementing large custom datapaths, control logic, and hardware accelerators.
Unique Advantages
- Large programmable capacity: 75,000 logic elements enable complex designs and feature-rich implementations without immediate part upgrades.
- Significant on-chip memory: Approximately 8.66 Mbits of embedded RAM reduces dependence on external memory for many buffering and working-set needs.
- High I/O count: 336 I/Os support flexible interfacing and reduce the need for additional IO expansion hardware.
- Industrial-ready thermal range: Specified operation from −40 °C to 100 °C supports extended-environment applications.
- Dense, surface-mount packaging: 672-BBGA FCBGA package offers a compact footprint for high-density PCB designs.
- Regulatory compliance: RoHS compliance simplifies environmental qualification for many programs.
Why Choose 5AGXMA1D4F27I3G?
The 5AGXMA1D4F27I3G delivers a balanced combination of logic capacity, embedded memory, and I/O density in an industrial-grade Arria V GX FPGA. It is well suited to engineers who need a high-density programmable fabric with on-chip resources and robust temperature specifications for sustained operation.
As part of the Arria V family, this device is supported by comprehensive electrical and configuration documentation, enabling detailed design planning and system integration for performance-focused applications.
Request a quote or submit a part inquiry to begin integrating the 5AGXMA1D4F27I3G into your next design.

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