5AGXMA5G4F35C4N

The 5AGXMA5G4F35C4N is an Arria V GX Field Programmable Gate Array (FPGA) provided in a 1152‑BBGA FCBGA exposed‑pad package. It delivers substantial logic capacity and on‑chip memory in a high‑I/O, surface‑mount form factor suitable for commercial designs.

With 190,000 logic elements, approximately 13.28 Mbits of embedded memory and 544 I/O pins, this device is targeted at applications that require high logic density, significant embedded RAM and a large, flexible I/O footprint while operating within a commercial temperature range.

Key Features

• Core Logic  190,000 logic elements (LEs) provide extensive capacity for complex digital designs and high-density logic integration.
• Embedded Memory  Approximately 13.28 Mbits of on‑chip RAM to support buffering, state storage and memory‑intensive logic functions.
• I/O Density  544 I/O pins enable extensive peripheral interfacing and parallel connectivity options for high‑bandwidth systems.
• Package & Mounting  1152‑BBGA (FCBGA exposed pad) package; supplier package listed as 1152‑FBGA (35×35). Surface mount mounting type for board‑level integration.
• Power  Core voltage supply specified between 1.07 V and 1.13 V for the device core power domain.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C ambient operation. RoHS compliant.

Typical Applications

• High‑density digital processing  Implement complex FPGA logic and compute pipelines using the device’s 190,000 logic elements and large embedded RAM.
• Multi‑I/O systems  Leverage 544 I/O pins for interfacing multiple peripherals, parallel buses or wide data paths in communication and control systems.
• On‑board buffering and memory‑intensive tasks  Use approximately 13.28 Mbits of embedded memory for packet buffering, lookup tables and stateful processing without external RAM.

Unique Advantages

• High logic and memory density: Combine 190,000 logic elements with ~13.28 Mbits of embedded RAM to reduce external component count and consolidate functionality on‑chip.
• Extensive I/O capacity: 544 I/O pins provide design flexibility for complex interfaces, enabling broad system connectivity from a single FPGA device.
• Compact, board‑ready package: 1152‑BBGA (FCBGA exposed pad) in a 35×35 supplier footprint supports high‑density PCB integration and thermal conduction through the exposed pad.
• Tightly defined core voltage: A narrow supply window (1.07 V to 1.13 V) supports controlled core power delivery for predictable operation.
• Commercial temperature rating and RoHS compliance: Suitable for standard commercial applications with environmentally compliant manufacturing requirements.

Why Choose 5AGXMA5G4F35C4N?

The 5AGXMA5G4F35C4N Arria V GX FPGA balances large logic capacity, substantial embedded memory and a high I/O count in a compact surface‑mount FCBGA package. It is well suited to commercial designs that need to integrate complex digital functions, significant buffering and wide external connectivity while maintaining a predictable power and thermal profile.

Designed for engineers and system integrators seeking a single‑device solution to reduce board complexity and consolidate functionality, this device provides verified electrical and mechanical characteristics for reliable deployment in commercial applications.

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