5AGXMA5G4F35C5G

The 5AGXMA5G4F35C5G is an Intel Arria V GX field-programmable gate array (FPGA) supplied in a 1152-ball BGA package. It provides a high logic density core with 190,000 logic elements and abundant I/O, making it suitable for commercial-grade designs that require programmable digital logic, on-chip memory, and flexible interfacing.

Key architectural highlights include approximately 13.3 Mbits of embedded RAM, 544 I/O pins, and a specified core supply range of 1.07 V to 1.13 V. The device is RoHS compliant and offered in a surface-mount 1152-BBGA, FCBGA package rated for 0 °C to 85 °C operation.

Key Features

• Core Logic 190,000 logic elements provide a high-density programmable fabric for complex digital functions and custom accelerators.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM to support buffering, local storage, and memory-intensive logic implementations.
• High I/O Count 544 I/O pins enable extensive peripheral and interface connectivity for multi-channel designs and dense system integration.
• Power and Operating Conditions Core supply voltage specified between 1.07 V and 1.13 V; commercial-grade operating temperature range from 0 °C to 85 °C.
• Package and Mounting Surface-mount 1152-BBGA/FCBGA package (supplier package: 1152-FBGA, FC, 35×35) for compact board-level integration.
• Compliance RoHS compliant for environmentally responsible designs.

Typical Applications

• High-density logic designs — Implement complex custom digital functions and accelerators using the device’s 190,000 logic elements.
• Memory-intensive processing — Use the approximately 13.3 Mbits of embedded RAM for buffering, packet storage, or localized data handling.
• I/O-rich systems — Leverage 544 I/Os to connect multiple peripherals, sensors, or parallel interfaces on a single FPGA.
• Commercial embedded systems — Deploy in commercial applications requiring surface-mount integration and RoHS compliance within a 0 °C to 85 °C operating window.

Unique Advantages

• High integration density: 190,000 logic elements and significant embedded memory reduce external component needs and simplify board design.
• Extensive connectivity: 544 I/Os support complex multi-interface systems without requiring additional bridge devices.
• Compact packaging: 1152-ball BGA (35×35) offers a small footprint for space-constrained boards while supporting surface-mount assembly.
• Controlled power envelope: Narrow core supply range (1.07 V–1.13 V) helps in designing predictable power delivery and thermal profiles.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream embedded deployments.

Why Choose 5AGXMA5G4F35C5G?

The 5AGXMA5G4F35C5G Arria V GX FPGA combines substantial programmable logic capacity with plentiful embedded memory and high I/O counts in a compact 1152-BBGA package. Its commercial-grade rating and RoHS compliance make it well-suited for production embedded systems that need a balance of performance, integration, and manufacturability.

Designers building complex digital processing, buffering, or multi-interface solutions will find this device appropriate for consolidating functions onto a single programmable chip while maintaining predictable power and thermal requirements defined by the supplied voltage and operating-temperature ranges.

Request a quote or submit an inquiry to check pricing and availability for the 5AGXMA5G4F35C5G Arria V GX FPGA and to discuss how it can fit into your next design.