5AGXMA5G4F35I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 868 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8962 | Number of Logic Elements/Cells | 190000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13284352 |
Overview of 5AGXMA5G4F35I5N – Arria V GX FPGA, 544 I/O, approximately 13.28 Mbits RAM, 190,000 logic elements, 1152-BBGA
The 5AGXMA5G4F35I5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in an industrial-grade package. It combines large programmable logic capacity and on-chip memory with a high I/O count and a compact FCBGA package for surface-mount integration.
Designed for applications that require extended temperature operation and wide I/O connectivity, this device provides a balance of logic resources, embedded RAM, and robust package options to support complex system designs.
Key Features
- Large Logic Capacity The device provides 190,000 logic elements to implement complex digital designs and high-density logic functions.
- Embedded Memory Approximately 13.28 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage within logic pipelines.
- High I/O Count 544 user I/O pins to support diverse peripheral sets, wide parallel interfaces, and multiple I/O domains.
- Industrial Grade and Temperature Range Rated for industrial operation with an operating temperature range of −40 °C to 100 °C for deployments in demanding environments.
- Precision Core Power Core voltage operation specified between 1.07 V and 1.13 V for validated power and timing conditions.
- Package and Mounting 1152-BBGA (FCBGA exposed pad) supplier package (1152-FBGA, 35 × 35 mm) designed for surface-mount assembly and thermal handling.
- Standards Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Control and Automation Industrial-grade temperature rating and high I/O count enable reliable interfacing with sensors, actuators, and control buses in factory and process environments.
- High-density Digital Processing Large logic resource pool and on-chip RAM support compute-intensive tasks such as packet processing, data aggregation, and custom DSP pipelines.
- System Integration and Prototyping Compact FCBGA package with broad I/O makes this device suitable for advanced board-level integration and prototyping of complex systems.
Unique Advantages
- Substantial Logic Resource: 190,000 logic elements allow implementation of large-scale custom logic and parallel architectures without external logic expansion.
- Significant On-chip Memory: Approximately 13.28 Mbits of embedded RAM reduces dependence on external memory for many buffering and real-time data tasks.
- Wide I/O Flexibility: 544 I/O pins provide flexible connectivity options to accommodate multiple interfaces and high-pin-count peripherals.
- Industrial Reliability: Industrial-grade temperature operation (−40 °C to 100 °C) supports deployment in harsh or temperature-variable environments.
- Compact, Serviceable Package: 1152-BBGA (FCBGA exposed pad) offers a high-pin-count footprint in a 35 × 35 mm form factor for dense PCB designs with thermal pad support.
- Controlled Core Power: Narrow core voltage range (1.07 V–1.13 V) helps designers achieve predictable power and timing behavior within specified operating conditions.
Why Choose 5AGXMA5G4F35I5N?
The 5AGXMA5G4F35I5N combines a substantial logic fabric, noteworthy on-chip memory, and a large I/O complement in an industrial-grade Arria V GX package. This balance of resources makes it suitable for engineers building complex, high-channel-count systems that must operate across extended temperature ranges.
Manufactured by Intel and supported by detailed device documentation, the device is intended for designs that require scalable programmable logic, integrated memory, and robust packaging to simplify board-level integration and thermal management.
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