5AGXMA5G4F35I5N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA Exposed Pad

Quantity 868 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXMA5G4F35I5N – Arria V GX FPGA, 544 I/O, approximately 13.28 Mbits RAM, 190,000 logic elements, 1152-BBGA

The 5AGXMA5G4F35I5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in an industrial-grade package. It combines large programmable logic capacity and on-chip memory with a high I/O count and a compact FCBGA package for surface-mount integration.

Designed for applications that require extended temperature operation and wide I/O connectivity, this device provides a balance of logic resources, embedded RAM, and robust package options to support complex system designs.

Key Features

  • Large Logic Capacity  The device provides 190,000 logic elements to implement complex digital designs and high-density logic functions.
  • Embedded Memory  Approximately 13.28 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage within logic pipelines.
  • High I/O Count  544 user I/O pins to support diverse peripheral sets, wide parallel interfaces, and multiple I/O domains.
  • Industrial Grade and Temperature Range  Rated for industrial operation with an operating temperature range of −40 °C to 100 °C for deployments in demanding environments.
  • Precision Core Power  Core voltage operation specified between 1.07 V and 1.13 V for validated power and timing conditions.
  • Package and Mounting  1152-BBGA (FCBGA exposed pad) supplier package (1152-FBGA, 35 × 35 mm) designed for surface-mount assembly and thermal handling.
  • Standards Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control and Automation  Industrial-grade temperature rating and high I/O count enable reliable interfacing with sensors, actuators, and control buses in factory and process environments.
  • High-density Digital Processing  Large logic resource pool and on-chip RAM support compute-intensive tasks such as packet processing, data aggregation, and custom DSP pipelines.
  • System Integration and Prototyping  Compact FCBGA package with broad I/O makes this device suitable for advanced board-level integration and prototyping of complex systems.

Unique Advantages

  • Substantial Logic Resource: 190,000 logic elements allow implementation of large-scale custom logic and parallel architectures without external logic expansion.
  • Significant On-chip Memory: Approximately 13.28 Mbits of embedded RAM reduces dependence on external memory for many buffering and real-time data tasks.
  • Wide I/O Flexibility: 544 I/O pins provide flexible connectivity options to accommodate multiple interfaces and high-pin-count peripherals.
  • Industrial Reliability: Industrial-grade temperature operation (−40 °C to 100 °C) supports deployment in harsh or temperature-variable environments.
  • Compact, Serviceable Package: 1152-BBGA (FCBGA exposed pad) offers a high-pin-count footprint in a 35 × 35 mm form factor for dense PCB designs with thermal pad support.
  • Controlled Core Power: Narrow core voltage range (1.07 V–1.13 V) helps designers achieve predictable power and timing behavior within specified operating conditions.

Why Choose 5AGXMA5G4F35I5N?

The 5AGXMA5G4F35I5N combines a substantial logic fabric, noteworthy on-chip memory, and a large I/O complement in an industrial-grade Arria V GX package. This balance of resources makes it suitable for engineers building complex, high-channel-count systems that must operate across extended temperature ranges.

Manufactured by Intel and supported by detailed device documentation, the device is intended for designs that require scalable programmable logic, integrated memory, and robust packaging to simplify board-level integration and thermal management.

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