5AGXMA5G6F35C6G

The 5AGXMA5G6F35C6G is an Arria V GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA package. It delivers a high-count programmable fabric with 190,000 logic elements and approximately 12.7 Mbits of embedded RAM for dense digital implementations.

Designed as a commercial-grade device, this surface-mount FPGA offers 544 I/O pins, a compact 1152-FBGA (35 × 35 mm) package option, and a core voltage operating range of 1.07 V to 1.13 V, suitable for systems requiring high I/O density and substantial on-chip memory.

Key Features

• Programmable Logic Capacity — 190,000 logic elements provide the fabric for complex custom logic and large-scale integration.
• Embedded Memory — Total on-chip RAM of 13,284,352 bits (approximately 12.7 Mbits) to support buffering, FIFOs, and local storage.
• I/O and Package — 544 device I/O pins in a 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA, FC (35 × 35 mm) for compact board-level integration.
• Power — Core supply operating range of 1.07 V to 1.13 V for predictable power design and supply rail planning.
• Thermal and Grade — Commercial operating temperature range of 0°C to 85°C; product grade explicitly listed as Commercial.
• Mounting and Compliance — Surface mount package with RoHS compliance for modern assembly and environmental requirements.

Typical Applications

• Custom high-density logic — Implement large, customized digital functions that leverage 190,000 logic elements and substantial on-chip RAM.
• High-pin-count I/O designs — Systems requiring extensive parallel I/O or multi-interface connectivity can use the 544 available I/Os for board-level interfacing.
• Embedded memory-heavy functions — Designs needing local buffering, packet or data staging, and on-chip storage can take advantage of approximately 12.7 Mbits of RAM.

Unique Advantages

• High logic density: 190,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components.
• Large on-chip RAM: Approximately 12.7 Mbits of embedded memory supports complex data paths and reduces dependency on external SDRAM for many buffering tasks.
• Generous I/O count: 544 I/Os allow flexible partitioning of interfaces and direct connection to numerous peripherals or parallel buses.
• Compact FCBGA package: The 1152-FBGA (35 × 35 mm) package balances board area and pin density for space-constrained designs.
• Commercial temperature qualification: Rated 0°C to 85°C for typical commercial deployments and predictable thermal planning.
• RoHS compliant: Meets environmental compliance expectations for consumer and commercial production.

Why Choose 5AGXMA5G6F35C6G?

The 5AGXMA5G6F35C6G Arria V GX FPGA combines a high logic element count, multi-megabit embedded RAM, and a broad I/O complement in a compact 1152-FBGA package. Its commercial-grade rating and RoHS compliance make it suitable for mainstream embedded designs that require substantial on-chip resources and high I/O density.

This device is well suited to teams consolidating complex digital functions onto a single FPGA to simplify BOM, maintain signal integrity, and optimize board area, while relying on a defined core voltage range and commercial temperature limits for predictable system integration.

Request a quote or submit a procurement inquiry to receive pricing and availability for the 5AGXMA5G6F35C6G Arria V GX FPGA.