5AGXMA7D4F27C4G

The 5AGXMA7D4F27C4G is an Intel Arria V GX FPGA supplied in a 672-ball BGA (FCBGA) package. It delivers a high-density programmable fabric with 242,000 logic elements and approximately 15.47 Mbits of embedded RAM, making it appropriate for designs that require substantial on-chip logic and memory resources. The device is offered as a commercial-grade FPGA with a defined core supply range and operating temperature window for standard embedded and system-level applications.

Key Features

• Core Logic — 242,000 logic elements provide a large programmable fabric for custom logic, control, and data-path implementations.
• Embedded Memory — Approximately 15.47 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Capability — 336 user I/O pins to interface with external peripherals, memory, and high-pin-count subsystems.
• Package & Mounting — 672-BBGA, FCBGA package; supplier device package listed as 672-FBGA (27x27); surface-mount mounting type for board-level integration.
• Power — Specified core voltage supply between 1.07 V and 1.13 V for the FPGA core.
• Grade & Temperature — Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic capacity and embedded RAM to implement custom datapaths, protocol processing, and complex state machines.
• Interface aggregation — With 336 I/Os, consolidate multiple peripheral and memory interfaces onto a single programmable device.
• System-level prototyping and integration — Deploy as a platform for system validation and prototype development where significant programmable resources and on-chip memory are required.

Unique Advantages

• Substantial programmable capacity: 242,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Significant on-chip RAM: Approximately 15.47 Mbits of embedded memory supports large buffers and local data storage, minimizing external memory bandwidth needs.
• High I/O count: 336 I/Os provide flexibility for complex system interfacing and high-pin-count designs without external multiplexing.
• Ready for surface-mount production: 672-BBGA FCBGA packaging and 672-FBGA (27x27) supplier package simplify assembly in standard SMT workflows.
• Defined power and thermal window: Specified core voltage range (1.07–1.13 V) and commercial operating temperature (0 °C to 85 °C) allow predictable power budgeting and thermal planning.
• Regulatory alignment: RoHS compliance supports designs with environmental material restrictions.

Why Choose 5AGXMA7D4F27C4G?

This Arria V GX FPGA combines a large programmable logic array with substantial embedded memory and a high I/O count in a compact 672-ball BGA package, providing a balanced platform for designers who need to integrate multiple digital functions and interfaces on a single IC. The device’s defined supply range and commercial temperature rating make it suitable for standard embedded and system integration projects where predictable electrical and thermal behavior is required.

Engineers and procurement teams benefit from the device’s integration potential—reducing board complexity while preserving flexibility to update logic in-field—backed by Intel’s Arria V device documentation for design and electrical specifications.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering options for the 5AGXMA7D4F27C4G Arria V GX FPGA.