5AGXMA7D4F27I3G

The 5AGXMA7D4F27I3G is an Intel Arria V GX Field Programmable Gate Array packaged in a 672-ball FCBGA (27 × 27) surface-mount package. This industrial-grade device provides substantial programmable logic capacity, on-chip memory, and a high I/O count to support designs that require mid-to-high logic density and significant embedded memory resources.

Key electrical and environmental operating parameters include a core supply voltage range of 1.12 V to 1.18 V and an operating temperature range of –40 °C to 100 °C, and the device is RoHS compliant.

Key Features

• Logic Capacity  Provides 242,000 logic elements to implement complex programmable logic and custom compute functions.
• Configurable Logic Blocks  Includes 11,460 CLB-style logic blocks for structured logic partitioning and design scalability.
• Embedded Memory  Approximately 15.47 Mbits of on-chip RAM for buffers, packet memory, and intermediate data storage.
• I/O Resources  336 user I/O pins to support wide peripheral connectivity and multi-channel interfaces.
• Package and Mounting  672-BBGA (672-FBGA, 27 × 27) surface-mount package for compact board-level integration.
• Power  Core voltage supply specified at 1.12 V to 1.18 V to match system power-rail planning and regulator selection.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C to support deployments in temperature-challenging environments.
• Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• High-density logic implementations  Use the 242,000 logic elements and 11,460 logic blocks to implement complex state machines, custom datapaths, and control logic.
• Embedded memory buffering  Approximately 15.47 Mbits of on-chip RAM supports buffering, packet storage, and temporary data staging in FPGA-based systems.
• Multi-I/O interfacing  336 I/O pins enable integration with multiple peripherals, sensors, and external devices for flexible system I/O architectures.
• Industrial and rugged systems  The –40 °C to 100 °C rating and industrial grade make this device suitable for deployed equipment requiring extended temperature operation.

Unique Advantages

• High programmable logic density: 242,000 logic elements provide significant capacity for implementing large-scale logic and custom processing functions on a single device.
• Substantial embedded memory: Approximately 15.47 Mbits of RAM reduces dependence on external memory for many buffering and intermediate storage needs.
• Generous I/O availability: 336 user I/Os allow flexible interfacing and parallel connectivity options without immediate need for external I/O expansion.
• Industrial temperature capability: Rated from –40 °C to 100 °C for reliable operation in temperature-variable and industrial environments.
• Compact FCBGA package: 672-ball, 27 × 27 FBGA footprint balances board-area efficiency with routing and thermal considerations for high-density PCBs.
• Standards-friendly compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5AGXMA7D4F27I3G?

The 5AGXMA7D4F27I3G Arria V GX FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact industrial-grade FCBGA package. Its specified core voltage range and wide operating temperature window make it suitable for designs that demand reliable operation across varied environments while keeping system integration compact.

This device is a fit for engineering teams seeking a single-chip programmable solution that consolidates logic, memory, and I/O for mid-to-high complexity applications, providing a clear path to scalable, field-deployable hardware designs.

If you would like pricing, lead-time, or to request a formal quote for 5AGXMA7D4F27I3G, submit a quote request or contact the supplier team for purchasing information.