5AGXMA7D6F27C6G

The 5AGXMA7D6F27C6G is an Intel Arria V GX family Field Programmable Gate Array (FPGA) offered in a commercial grade. This high‑density, surface‑mount FPGA provides 242,000 logic elements and approximately 15.47 Mbits of embedded RAM to support complex programmable logic, on‑chip memory, and I/O‑rich designs. Its 672‑ball FCBGA package and 336 user I/O pins make it suitable for dense board layouts requiring broad I/O connectivity.

Key Features

• Logic Capacity — 242,000 logic elements for large combinational and sequential logic implementations and complex design partitioning.
• Embedded Memory — Approximately 15.47 Mbits of on‑chip RAM to support buffering, FIFOs, and on‑chip data storage.
• I/O Resources — 336 available I/O pins to accommodate wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 672‑BBGA (FCBGA) package, supplier device package 672‑FBGA (27×27), delivered in a surface‑mount form factor for high‑density PCB assembly.
• Power Envelope — Core supply operating range specified at 1.07 V to 1.13 V for defined power and timing characteristics.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C, suited to standard commercial environments.
• Compliance — RoHS‑compliant to meet standard environmental restrictions on hazardous substances.

Typical Applications

• High‑density programmable logic — Implement complex custom logic and state machines using 242,000 logic elements and on‑chip RAM for local storage.
• Memory‑intensive processing — Use the approximately 15.47 Mbits of embedded RAM for buffering, packet queues, and intermediate data processing.
• I/O‑centric systems — Leverage 336 I/O pins for multiple parallel interfaces, wide buses, or mixed signal front‑end connections.

Unique Advantages

• Substantial logic density: 242,000 logic elements enable large designs and extensive feature integration on a single FPGA.
• Significant on‑chip RAM: Approximately 15.47 Mbits of embedded memory reduces reliance on external memory for many buffering and staging tasks.
• Broad I/O availability: 336 I/O pins provide flexibility for high‑pin‑count interfaces without requiring additional bridge logic.
• Compact, manufacturable package: 672‑ball FCBGA in a 27×27 footprint supports high‑density PCB designs and standard surface‑mount assembly.
• Commercial grade suitability: Specified for 0 °C to 85 °C operation, aligning with typical commercial product requirements.
• Regulatory readiness: RoHS compliance helps streamline environmental compliance for product manufacturing.

Why Choose 5AGXMA7D6F27C6G?

The 5AGXMA7D6F27C6G Arria V GX FPGA combines high logic capacity, substantial embedded memory, and ample I/O in a single surface‑mount FCBGA package. Its defined core voltage range and commercial temperature rating make it a clear choice for designers who need a programmable, on‑board compute fabric with significant internal resources and flexible I/O for mid‑to‑high complexity systems.

This device is well suited to development teams and procurement groups targeting scalable FPGA integration where on‑chip RAM, logic density, and board‑level I/O count are principal selection criteria. It provides a balance of integration and manufacturability for commercial applications supported by Intel’s Arria V device family documentation.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead‑time information for the 5AGXMA7D6F27C6G Arria V GX FPGA.