5AGXMA7G4F31C5G

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA

Quantity 633 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXMA7G4F31C5G – Arria V GX FPGA, approximately 242,000 logic elements, ~15.47 Mbits RAM, 384 I/Os, 896-FBGA

The 5AGXMA7G4F31C5G is an Arria V GX field programmable gate array (FPGA) in a 896-FBGA (31×31) surface-mount package. Designed for commercial-grade systems, this device combines high logic capacity and embedded memory with a dense I/O count, enabling complex, memory‑rich designs within a compact FCBGA footprint.

Key attributes visible in the product data include approximately 242,000 logic elements, roughly 15.47 Mbits of on‑chip RAM, a 384‑pin I/O complement, and a specified core supply range of 1.07 V to 1.13 V. The device is RoHS compliant and rated for 0 °C to 85 °C operation.

Key Features

  • Core Logic Capacity  Approximately 242,000 logic elements provide substantial resources for implementing large-scale combinational and sequential logic.
  • Embedded Memory  Approximately 15.47 Mbits of on‑chip RAM supports data buffering, FIFOs, and other memory‑intensive functions.
  • High I/O Density  384 user I/Os enable broad connectivity for parallel interfaces, custom bus implementations, and multi-channel designs.
  • Package and Mounting  896‑FBGA (31×31) package in a surface‑mount form factor for high‑density board integration.
  • Power Supply Range  Specified core voltage range of 1.07 V to 1.13 V to meet defined operating conditions for the device.
  • Commercial Grade Temperature  Rated for 0 °C to 85 °C operation for typical commercial applications.
  • Regulatory Compliance  RoHS compliant for environmental and supply‑chain requirements.

Typical Applications

  • High-density logic systems  Leverage the device’s ~242,000 logic elements to implement complex state machines, custom accelerators, and large combinational logic blocks.
  • Memory‑intensive designs  Use the approximately 15.47 Mbits of on‑chip RAM for buffering, packet storage, and streaming data processing.
  • Custom I/O and interface bridging  The 384 I/Os enable protocol conversion, parallel sensor arrays, and multi‑channel I/O front ends.
  • Compact, board‑level integration  The 896‑FBGA surface‑mount package supports dense PCB layouts where board space is constrained.

Unique Advantages

  • Large logic fabric:  Approximately 242,000 logic elements give designers the headroom to implement sizeable, complex functions without partitioning across multiple devices.
  • Significant on‑chip memory:  Roughly 15.47 Mbits of embedded RAM minimizes the need for external memory in many buffering and streaming use cases.
  • Generous I/O count:  384 I/Os simplify system integration by accommodating multiple interfaces and parallel signal paths directly on the FPGA.
  • Compact FCBGA package:  896‑FBGA (31×31) balances I/O density and board‑level footprint for space‑sensitive designs.
  • Controlled core supply:  A defined 1.07 V to 1.13 V core voltage range helps with predictable power sequencing and system power budgeting.
  • Commercial temperature rating and RoHS compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployment.

Why Choose 5AGXMA7G4F31C5G?

The 5AGXMA7G4F31C5G Arria V GX FPGA is positioned for commercial applications that require substantial logic resources, embedded memory, and a high number of I/Os within a compact FCBGA package. Its combination of approximately 242,000 logic elements and roughly 15.47 Mbits of on‑chip RAM allows designers to consolidate functions and reduce external component count.

Choose this device when your design demands large programmable logic capacity, extensive internal memory, and flexible I/O in a surface‑mount 896‑FBGA package, backed by RoHS compliance and a commercial temperature rating.

If you need pricing, availability, or a formal quote for 5AGXMA7G4F31C5G, request a quote or submit an inquiry to receive detailed ordering information and lead‑time guidance.

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