5AGXMA7G4F31I3

The 5AGXMA7G4F31I3 is an Arria V GX Field Programmable Gate Array (FPGA) IC by Intel, offered in an industrial grade configuration. It combines a large programmable fabric with substantial on-chip RAM and a high I/O count in a compact 896-ball BGA package, addressing designs that require reconfigurable logic, embedded memory, and robust operating conditions.

Key Features

• Core Logic Capacity — 242,000 logic elements provide extensive programmable resources for implementing complex digital functions and custom accelerators.
• Embedded Memory — Approximately 15.47 Mbits of total RAM bits available on-chip to support buffering, lookup tables, and data storage for real-time processing.
• I/O Resources — 384 user I/O pins enable broad peripheral and interface integration without requiring extensive external multiplexing.
• Power Supply — Operates from a core voltage supply range of 1.12 V to 1.18 V, enabling predictable power planning for system designs.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Package & Mounting — 896-BBGA (FCBGA) package, supplier device package listed as 896-FBGA (31×31); surface-mount mounting type supports modern PCB assembly.
• Environmental Compliance — RoHS compliant to support environmentally regulated product builds.

Typical Applications

• Industrial Control — Industrial-grade temperature rating and large logic capacity suit factory automation, motion control, and machine vision control logic.
• Signal Processing — High logic density and on-chip RAM make the device appropriate for custom signal-path implementations and real-time data handling.
• Networking & Connectivity — Extensive I/O resources support multiple interface endpoints and board-level protocol implementations.
• Prototyping & Custom IP — Reconfigurable fabric and abundant logic elements enable rapid iteration of custom IP and hardware validation.

Unique Advantages

• High integration in a single device: Large logic capacity and substantial embedded RAM reduce the need for multiple discrete components and simplify system architecture.
• Robust operating range: Industrial temperature qualification (–40 °C to 100 °C) permits deployment in harsh or outdoor installations.
• Compact, high-density packaging: 896-ball BGA (31×31) delivers many I/Os and silicon in a compact footprint for space-constrained boards.
• Deterministic power planning: Narrow core voltage range (1.12 V to 1.18 V) aids in designing stable power delivery networks for the FPGA core.
• Environmentally compliant: RoHS compliance supports designs that must meet environmental regulatory requirements.

Why Choose 5AGXMA7G4F31I3?

The 5AGXMA7G4F31I3 Arria V GX FPGA delivers a combination of high logic density, significant on-chip memory, and broad I/O capability in an industrial-grade, surface-mount BGA package. It is well suited for developers and procurement teams targeting complex, reconfigurable systems that require sustained operation across a wide temperature range and predictable power requirements.

As an Intel Arria V GX device, this FPGA is positioned for applications that demand scalable logic resources and embedded RAM while maintaining compact board-level integration and RoHS compliance.

Request a quote or submit a purchasing inquiry to evaluate 5AGXMA7G4F31I3 for your next design or production run.