5AGXMA7G4F31I5G

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA

Quantity 453 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXMA7G4F31I5G – Arria V GX Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA

The 5AGXMA7G4F31I5G is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in an industrial grade package. It delivers 242,000 logic elements, approximately 15.47 Mbits of embedded memory, and 384 user I/Os in a high-pin-count BGA footprint.

Designed for surface-mount applications that require high logic density, substantial on-chip RAM, and robust I/O capability, this device operates from a core supply range of 1.07 V to 1.13 V and is specified for −40 °C to 100 °C operation.

Key Features

  • Logic Capacity  Provides 242,000 logic elements to implement complex programmable logic and custom hardware accelerators.
  • Embedded Memory  Approximately 15.47 Mbits of on-chip RAM for buffering, state storage, and data manipulation without external memory.
  • I/O Resources  384 user I/Os support dense external connectivity and flexible interfacing to peripherals and board-level signals.
  • Industrial Grade  Rated as an industrial device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Package and Mounting  Delivered in an 896-BBGA (FCBGA) package; supplier device package listed as 896-FBGA (31×31). Surface-mount mounting type for standard PCB assembly.
  • Power  Core supply specified between 1.07 V and 1.13 V to guide power-supply design and power budgeting.
  • Compliance  RoHS compliant.
  • Comprehensive Documentation  Arria V device datasheet coverage includes electrical characteristics, switching characteristics, configuration specifications, and I/O timing for design validation and integration.

Typical Applications

  • Industrial Control and Automation  Industrial-grade temperature rating and high logic density enable control algorithms, real-time processing, and deterministic I/O handling in factory and process environments.
  • High-Density I/O Systems  With 384 user I/Os, the device supports complex board-level interfacing, sensor aggregation, and multi-channel data routing.
  • Embedded Memory-Intensive Designs  Approximately 15.47 Mbits of on-chip RAM supports buffering, packet processing, and intermediate data storage without immediate reliance on external memory.

Unique Advantages

  • High Logic Integration: 242,000 logic elements enable implementation of large, consolidated FPGA-based subsystems to reduce external components.
  • Significant On-Chip Memory: Approximately 15.47 Mbits of embedded RAM reduces system-level external memory requirements and simplifies board design.
  • Extensive I/O Count: 384 I/Os provide flexibility for multi-interface designs, parallel data paths, and dense peripheral connectivity.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh and temperature-variable environments.
  • High-Pin-Count, Surface-Mount Package: The 896-FBGA (31×31) footprint delivers maximum I/O density in a compact, assembly-friendly form factor.
  • Well-Documented Device Family: Detailed datasheet material covering electrical, switching, configuration, and I/O timing information helps accelerate integration and verification.

Why Choose 5AGXMA7G4F31I5G?

The 5AGXMA7G4F31I5G balances high programmable logic capacity, sizeable on-chip RAM, and a large I/O complement in an industrial-grade BGA package. Its specified core voltage range and operating temperature make it suitable for designs that need predictable electrical and environmental behavior. Engineers and system designers looking to consolidate functionality, minimize external memory dependence, and implement complex I/O-rich systems will find the Arria V GX device a practical option.

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