5AGXMA7G4F35C4N

The 5AGXMA7G4F35C4N is an Intel Arria V GX FPGA device in a 1152‑BBGA FCBGA exposed‑pad package designed for surface‑mount applications. It delivers substantial programmable logic capacity, embedded RAM, and a high I/O count for complex digital designs.

With a core supply range of 1.07 V to 1.13 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that require high-density programmable logic, significant on‑chip memory, and broad I/O connectivity while meeting RoHS environmental requirements.

Key Features

• Logic Capacity — Approximately 242,000 logic elements to implement complex custom digital logic and accelerators.
• Embedded Memory — Approximately 15.47 Mbits of on‑chip RAM for buffering, state storage, and data paths without immediate external memory dependency.
• High I/O Count — 544 user I/O pins to support extensive peripheral and parallel interfaces.
• Package & Mounting — 1152‑BBGA (FCBGA exposed pad) / supplier package 1152‑FBGA (35×35) in a surface‑mount form factor for compact board integration.
• Power Domain — Core supply range of 1.07 V to 1.13 V, enabling precise power budgeting for system design.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory Compliance — RoHS compliant, suitable for designs requiring lead‑free assembly and environmental compliance.
• Documentation — Supported by the Arria V device datasheet covering electrical characteristics, configuration timing, I/O timing, and performance specifications.

Typical Applications

• High‑density digital systems — Use the large logic element count to implement custom processing, protocol handling, and hardware accelerators.
• Memory‑centric designs — Leverage approximately 15.47 Mbits of embedded RAM for buffering, packet queues, and temporary data storage within the FPGA fabric.
• Complex I/O platforms — Employ 544 I/O pins for multi‑lane interfaces, high‑pin‑count peripherals, and extensive sensor or board interconnects.

Unique Advantages

• High logic density: Approximately 242,000 logic elements reduce the need for external glue logic and allow large designs to reside on a single device.
• Substantial embedded memory: Around 15.47 Mbits of on‑chip RAM helps keep data paths internal, lowering latency and simplifying BOM.
• Broad I/O capability: 544 user I/Os provide flexible connectivity for diverse interface requirements without multiplexing compromises.
• Compact BGA packaging: The 1152‑BBGA FCBGA exposed‑pad package enables high pin density in a board‑space efficient solution for surface‑mount assembly.
• Commercial temperature & RoHS compliance: Designed for mainstream commercial applications with lead‑free, RoHS‑compliant materials.

Why Choose 5AGXMA7G4F35C4N?

The 5AGXMA7G4F35C4N combines significant programmable logic capacity, multi‑megabit on‑chip RAM, and a high I/O count in a surface‑mount 1152‑BBGA package, making it well suited to complex digital designs that require tight integration and high connectivity. Its defined core voltage range and commercial temperature rating make it appropriate for a wide range of mainstream embedded and communication applications.

Engineers selecting this Arria V GX device benefit from detailed device documentation and electrical specifications provided in the Arria V datasheet, enabling precise system design, power budgeting, and timing analysis for reliable implementation.

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