5AGXMA7G4F35C5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,545 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXMA7G4F35C5G – Arria V GX FPGA, 242,000 logic elements, 544 I/O, 1152-BBGA
The 5AGXMA7G4F35C5G is an Arria V GX Field Programmable Gate Array (FPGA) designed for high-density programmable logic applications. It integrates 242,000 logic elements and approximately 15.47 Mbits of embedded memory to support complex logic and data buffering on a single device.
With up to 544 user I/Os, a surface-mount 1152-BBGA (FCBGA) package, a core supply range of 1.07–1.13 V, and commercial operating temperature grading (0 °C to 85 °C), this device targets designs that require significant logic capacity, substantial on-chip RAM, and broad I/O connectivity.
Key Features
- Logic Density — 242,000 logic elements for implementing large-scale, custom digital designs and complex state machines.
- Logic Array Blocks — 11,460 logic array blocks to structure and distribute programmable logic resources efficiently across the device.
- Embedded Memory — Approximately 15.47 Mbits of on-chip RAM for buffering, FIFOs, and memory-mapped functions without external memory dependence.
- I/O Capacity — Up to 544 user I/O pins to support wide parallel interfaces, peripheral expansion, and high fanout designs.
- Power and Voltage — Core supply operating range of 1.07 V to 1.13 V to match platform power delivery and integration requirements.
- Package and Mounting — 1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA, FC (35×35), and designed for surface-mount assembly.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
- RoHS Compliant — Conforms to RoHS requirements to meet environmental and manufacturing standards.
Typical Applications
- High-density programmable logic — Implement large custom logic functions and complex control systems using the device’s 242,000 logic elements.
- Memory-intensive designs — Use approximately 15.47 Mbits of embedded RAM for data buffering, packet queues, and on-chip storage.
- Multiport I/O systems — Leverage up to 544 I/O pins for broad peripheral interfacing, parallel data paths, and multi-channel connectivity.
Unique Advantages
- High integration density: 242,000 logic elements and 11,460 logic array blocks enable consolidation of complex functions into a single FPGA, reducing system-level component count.
- Substantial on-chip memory: Approximately 15.47 Mbits of embedded RAM minimizes reliance on external memory for many buffering and data-processing tasks.
- Broad I/O capability: Up to 544 I/O pins provide flexibility to connect multiple peripherals, sensors, or parallel data streams without external multiplexing.
- Compact, production-ready package: 1152-BBGA (35×35) surface-mount footprint supports high-density PCB designs and automated assembly.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
- Environmentally compliant: RoHS compliance simplifies regulatory adherence and manufacturing planning.
Why Choose 5AGXMA7G4F35C5G?
The 5AGXMA7G4F35C5G Arria V GX FPGA is positioned for designs that demand a balance of large programmable logic capacity, significant embedded memory, and extensive I/O connectivity in a single, surface-mount BGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of standard embedded and system-level applications.
Choose this device when you need scalable logic resources, on-chip RAM for buffering and data flow, and a compact package that supports automated assembly and high I/O counts—delivering clear system-level integration benefits and long-term design scalability.
If you would like pricing, availability, or to submit a quote request for 5AGXMA7G4F35C5G, please request a quote or submit an inquiry through your preferred purchasing channel.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018