5AGXMA7G4F35C5G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA

Quantity 1,545 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXMA7G4F35C5G – Arria V GX FPGA, 242,000 logic elements, 544 I/O, 1152-BBGA

The 5AGXMA7G4F35C5G is an Arria V GX Field Programmable Gate Array (FPGA) designed for high-density programmable logic applications. It integrates 242,000 logic elements and approximately 15.47 Mbits of embedded memory to support complex logic and data buffering on a single device.

With up to 544 user I/Os, a surface-mount 1152-BBGA (FCBGA) package, a core supply range of 1.07–1.13 V, and commercial operating temperature grading (0 °C to 85 °C), this device targets designs that require significant logic capacity, substantial on-chip RAM, and broad I/O connectivity.

Key Features

  • Logic Density — 242,000 logic elements for implementing large-scale, custom digital designs and complex state machines.
  • Logic Array Blocks — 11,460 logic array blocks to structure and distribute programmable logic resources efficiently across the device.
  • Embedded Memory — Approximately 15.47 Mbits of on-chip RAM for buffering, FIFOs, and memory-mapped functions without external memory dependence.
  • I/O Capacity — Up to 544 user I/O pins to support wide parallel interfaces, peripheral expansion, and high fanout designs.
  • Power and Voltage — Core supply operating range of 1.07 V to 1.13 V to match platform power delivery and integration requirements.
  • Package and Mounting — 1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA, FC (35×35), and designed for surface-mount assembly.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
  • RoHS Compliant — Conforms to RoHS requirements to meet environmental and manufacturing standards.

Typical Applications

  • High-density programmable logic — Implement large custom logic functions and complex control systems using the device’s 242,000 logic elements.
  • Memory-intensive designs — Use approximately 15.47 Mbits of embedded RAM for data buffering, packet queues, and on-chip storage.
  • Multiport I/O systems — Leverage up to 544 I/O pins for broad peripheral interfacing, parallel data paths, and multi-channel connectivity.

Unique Advantages

  • High integration density: 242,000 logic elements and 11,460 logic array blocks enable consolidation of complex functions into a single FPGA, reducing system-level component count.
  • Substantial on-chip memory: Approximately 15.47 Mbits of embedded RAM minimizes reliance on external memory for many buffering and data-processing tasks.
  • Broad I/O capability: Up to 544 I/O pins provide flexibility to connect multiple peripherals, sensors, or parallel data streams without external multiplexing.
  • Compact, production-ready package: 1152-BBGA (35×35) surface-mount footprint supports high-density PCB designs and automated assembly.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
  • Environmentally compliant: RoHS compliance simplifies regulatory adherence and manufacturing planning.

Why Choose 5AGXMA7G4F35C5G?

The 5AGXMA7G4F35C5G Arria V GX FPGA is positioned for designs that demand a balance of large programmable logic capacity, significant embedded memory, and extensive I/O connectivity in a single, surface-mount BGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of standard embedded and system-level applications.

Choose this device when you need scalable logic resources, on-chip RAM for buffering and data flow, and a compact package that supports automated assembly and high I/O counts—delivering clear system-level integration benefits and long-term design scalability.

If you would like pricing, availability, or to submit a quote request for 5AGXMA7G4F35C5G, please request a quote or submit an inquiry through your preferred purchasing channel.

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