5AGXMA7G4F35I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 130 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXMA7G4F35I5N – Arria V GX FPGA, 1152‑BBGA
The 5AGXMA7G4F35I5N is an Intel Arria V GX field programmable gate array (FPGA) in an industrial-grade surface-mount package. It delivers a large programmable fabric with high I/O density and substantial on-chip memory, suitable for demanding embedded and industrial applications.
Engineered for designs that require significant logic capacity, abundant embedded RAM, and broad interfacing capability, the device provides a compact 1152‑BBGA (1152‑FBGA, 35×35) footprint with an exposed pad for thermal management and a core supply window of 1.07 V to 1.13 V.
Key Features
- Core Logic — Approximately 242,000 logic elements for implementing complex digital functions and custom accelerators.
- Embedded Memory — Approximately 15.47 Mbits of on-chip RAM to support buffering, processing, and state storage without external memory for many use cases.
- I/O Density — 544 user I/O pins to support a wide range of peripheral interfaces and high-pin-count designs.
- Package & Mounting — 1152‑BBGA, FCBGA exposed pad; supplier device package listed as 1152‑FBGA (35×35); surface-mount mounting type.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial-environment deployments.
- Core Supply — Narrow core voltage operating window (1.07 V to 1.13 V) to match precision power-delivery designs.
- Standards & Compliance — RoHS compliant.
Typical Applications
- Industrial Control & Automation — Deploy deterministic logic and real-time control functions using high logic capacity and industrial temperature rating.
- High‑Density I/O Systems — Interface to large numbers of sensors, actuators, or peripherals via 544 user I/Os for complex system integration.
- Embedded Processing & Prototyping — Implement custom processing blocks and system prototypes that require significant embedded RAM and programmable logic.
- Communications & Networking Infrastructure — Use on-chip logic and memory for packet processing, protocol bridging, and interface aggregation in infrastructure equipment.
Unique Advantages
- Substantial Logic Capacity: Approximately 242,000 logic elements enable large finite-state machines, custom datapaths, and parallel processing blocks in a single device.
- Significant On‑Chip Memory: Roughly 15.47 Mbits of embedded RAM reduce dependence on external memory for many buffering and caching tasks, simplifying board design.
- High I/O Count: 544 I/Os provide flexibility to connect multiple peripherals and interfaces without resorting to external multiplexing.
- Industrial‑Grade Operation: Rated for −40 °C to 100 °C, making the device suitable for a broad range of industrial environments and deployments.
- Compact, Thermally-Aware Package: 1152‑BBGA / 1152‑FBGA (35×35) with exposed pad and surface-mount form factor supports dense, production-ready board layouts and thermal dissipation approaches.
- Regulatory Compliance: RoHS compliance supports regulatory requirements for many global product lines.
Why Choose 5AGXMA7G4F35I5N?
The 5AGXMA7G4F35I5N Arria V GX FPGA balances large programmable logic resources, substantial embedded memory, and high I/O density in a compact industrial-grade package. It is well suited to engineering teams building complex embedded systems, industrial controllers, networking appliances, and prototype platforms that require a single-chip solution with strong logic and memory capability.
As part of the Intel Arria V family, this device is documented by comprehensive device-level specifications and datasheets, making it a practical choice for designs that demand predictable electrical characteristics, defined operating conditions, and industrial temperature support.
Request a quote or submit an inquiry today to evaluate the 5AGXMA7G4F35I5N for your next design or production run.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018