5AGXMA7G6F35C6G

The 5AGXMA7G6F35C6G is an Arria V GX FPGA in a 1152-BBGA (FCBGA) package, offered in a commercial grade. It integrates substantial programmable logic and on-chip RAM to support complex digital designs that require a balance of logic density, memory resources, and large I/O counts.

Key attributes include approximately 242,000 logic elements, roughly 15.47 Mbits of embedded RAM, and 544 I/Os. The device is specified for surface-mount PCB assembly and operates across a core voltage range of 1.07 V to 1.13 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• High logic density: Approximately 242,000 logic elements provide capacity for complex combinational and sequential logic integration.
• Logic array blocks (LABs): 11,460 LABs for structured logic partitioning and floorplanning.
• On-chip embedded memory: Approximately 15.47 Mbits of total RAM bits available for data buffering, state storage, and small-memory applications.
• Large I/O count: 544 I/Os to support dense peripheral interfaces and multi-channel connectivity needs.
• Package and mounting: 1152-BBGA (FCBGA) supplier device package (1152-FBGA, FC 35×35) optimized for compact board integration; surface-mount mounting type.
• Supply and thermal: Core voltage specified from 1.07 V to 1.13 V with an operating ambient temperature range of 0 °C to 85 °C (commercial grade).
• Regulatory compliance: RoHS compliant.

Typical Applications

• High-density digital processing: Use the large logic element count and embedded RAM to implement complex signal processing and control algorithms.
• I/O-intensive systems: Leverage 544 I/Os for designs requiring broad external connectivity and multiple parallel interfaces.
• Embedded system prototypes and production designs: The commercial grade temperature range and surface-mount FCBGA package fit a variety of board-level embedded applications.

Unique Advantages

• Substantial programmable capacity: Nearly 242,000 logic elements enable integration of large functional blocks on a single device, reducing external component count.
• Significant on-chip memory: Approximately 15.47 Mbits of RAM supports buffering, frame storage, and large state machines without external memory.
• Extensive peripheral connectivity: 544 I/Os allow flexible interfacing to sensors, transceivers, FPGAs, and custom peripherals.
• Compact, manufacturable package: 1152-BBGA (35×35) FCBGA package supports high-density board layouts with surface-mount assembly.
• Commercial-grade specification: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic products.

Why Choose 5AGXMA7G6F35C6G?

This Arria V GX FPGA is positioned for designers who require a balance of high logic density, embedded RAM, and a large number of I/Os in a single, surface-mount FCBGA package. Its commercial grade rating and defined supply/temperature specifications make it suitable for mainstream embedded and digital designs where integration and board-level space savings are priorities.

Engineers can rely on the provided device-level specs—logic element capacity, on-chip RAM, I/O count, package information, and operating ranges—to plan system resources, power supplies, and thermal management with precision.

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