5AGXMB1G4F31C4G

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 17358848 300000 896-BBGA, FCBGA

Quantity 701 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14151Number of Logic Elements/Cells300000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits17358848

Overview of 5AGXMB1G4F31C4G – Arria V GX FPGA, 300,000 logic elements, 384 I/O

The 5AGXMB1G4F31C4G is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 896-BBGA FCBGA package. This device delivers high-density programmable logic with substantial on-chip memory and a large I/O count for designs that require significant logic, memory and signal connectivity within a compact, surface-mount package.

Designed and specified for commercial-grade operation, the device provides tightly defined core voltage and thermal operating ranges, and is RoHS compliant. The Arria V device datasheet includes detailed electrical characteristics, configuration timing and I/O timing for integration and system design.

Key Features

  • High logic density — 300,000 logic elements to implement complex digital functions and parallel architectures.
  • Embedded memory — Total on-chip RAM of 17,358,848 bits, approximately 17.36 Mbits of embedded memory for buffering, state storage and local data processing.
  • Generous I/O — 384 user I/O pins to support wide bus interfaces, multiple peripherals and high channel counts.
  • Package and mounting — 896-BBGA (896-FBGA, 31×31) surface-mount package that balances high pin-count routing with a compact board footprint.
  • Power and operating range — Core voltage supply specified from 1.07 V to 1.13 V to meet design power rails; commercial operating temperature range of 0 °C to 85 °C.
  • Manufacturing and compliance — Intel-manufactured device with RoHS compliance for environmental requirements.

Typical Applications

  • High-density FPGA designs — Implement complex logic, state machines and parallel processing in a single programmable device.
  • I/O-rich systems — Support multiple external interfaces and wide buses with 384 available I/O pins.
  • On-chip buffering and data processing — Use the approximately 17.36 Mbits of embedded memory for packet buffering, local data storage and intermediate processing.
  • Compact board designs — Integrate high pin-count functionality in a 896-BBGA (31×31) surface-mount package for space-constrained PCBs.

Unique Advantages

  • Substantial programmable resources: 300,000 logic elements provide capacity for sizeable designs without partitioning across multiple devices.
  • Significant on-chip memory: Approximately 17.36 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
  • High connectivity: 384 I/O pins allow dense peripheral integration and flexible interfacing to external devices and subsystems.
  • Compact, manufacturable package: The 896-FBGA (31×31) package offers a balance of pin count and PCB area for production surface-mount assembly.
  • Clear operating specifications: Defined core voltage window and commercial temperature range simplify power supply and thermal planning.
  • RoHS compliant: Meets environmental compliance requirements common in modern electronics manufacturing.

Why Choose 5AGXMB1G4F31C4G?

The 5AGXMB1G4F31C4G Arria V GX FPGA provides a combination of high logic capacity, ample embedded memory and extensive I/O in a compact 896-BBGA surface-mount package. It is suited to designs that require dense programmable logic and significant local memory while operating within commercial temperature limits and a tightly specified core voltage range.

This Intel-manufactured device is accompanied by the Arria V device datasheet, which documents electrical characteristics, configuration timing and I/O timing to support integration and system validation. The device is appropriate for engineering teams building complex digital systems that prioritize logic density, on-chip memory and board-area efficiency.

If you would like pricing, availability or to request a formal quote for 5AGXMB1G4F31C4G, submit a quote request or contact sales through your usual procurement channel to initiate the process.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up