5AGXMB1G4F31C4G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 17358848 300000 896-BBGA, FCBGA |
|---|---|
| Quantity | 701 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXMB1G4F31C4G – Arria V GX FPGA, 300,000 logic elements, 384 I/O
The 5AGXMB1G4F31C4G is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 896-BBGA FCBGA package. This device delivers high-density programmable logic with substantial on-chip memory and a large I/O count for designs that require significant logic, memory and signal connectivity within a compact, surface-mount package.
Designed and specified for commercial-grade operation, the device provides tightly defined core voltage and thermal operating ranges, and is RoHS compliant. The Arria V device datasheet includes detailed electrical characteristics, configuration timing and I/O timing for integration and system design.
Key Features
- High logic density — 300,000 logic elements to implement complex digital functions and parallel architectures.
- Embedded memory — Total on-chip RAM of 17,358,848 bits, approximately 17.36 Mbits of embedded memory for buffering, state storage and local data processing.
- Generous I/O — 384 user I/O pins to support wide bus interfaces, multiple peripherals and high channel counts.
- Package and mounting — 896-BBGA (896-FBGA, 31×31) surface-mount package that balances high pin-count routing with a compact board footprint.
- Power and operating range — Core voltage supply specified from 1.07 V to 1.13 V to meet design power rails; commercial operating temperature range of 0 °C to 85 °C.
- Manufacturing and compliance — Intel-manufactured device with RoHS compliance for environmental requirements.
Typical Applications
- High-density FPGA designs — Implement complex logic, state machines and parallel processing in a single programmable device.
- I/O-rich systems — Support multiple external interfaces and wide buses with 384 available I/O pins.
- On-chip buffering and data processing — Use the approximately 17.36 Mbits of embedded memory for packet buffering, local data storage and intermediate processing.
- Compact board designs — Integrate high pin-count functionality in a 896-BBGA (31×31) surface-mount package for space-constrained PCBs.
Unique Advantages
- Substantial programmable resources: 300,000 logic elements provide capacity for sizeable designs without partitioning across multiple devices.
- Significant on-chip memory: Approximately 17.36 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
- High connectivity: 384 I/O pins allow dense peripheral integration and flexible interfacing to external devices and subsystems.
- Compact, manufacturable package: The 896-FBGA (31×31) package offers a balance of pin count and PCB area for production surface-mount assembly.
- Clear operating specifications: Defined core voltage window and commercial temperature range simplify power supply and thermal planning.
- RoHS compliant: Meets environmental compliance requirements common in modern electronics manufacturing.
Why Choose 5AGXMB1G4F31C4G?
The 5AGXMB1G4F31C4G Arria V GX FPGA provides a combination of high logic capacity, ample embedded memory and extensive I/O in a compact 896-BBGA surface-mount package. It is suited to designs that require dense programmable logic and significant local memory while operating within commercial temperature limits and a tightly specified core voltage range.
This Intel-manufactured device is accompanied by the Arria V device datasheet, which documents electrical characteristics, configuration timing and I/O timing to support integration and system validation. The device is appropriate for engineering teams building complex digital systems that prioritize logic density, on-chip memory and board-area efficiency.
If you would like pricing, availability or to request a formal quote for 5AGXMB1G4F31C4G, submit a quote request or contact sales through your usual procurement channel to initiate the process.

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