5AGXMB1G4F31I3G

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 17358848 300000 896-BBGA, FCBGA

Quantity 166 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.12 V - 1.18 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14151Number of Logic Elements/Cells300000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits17358848

Overview of 5AGXMB1G4F31I3G – Arria V GX FPGA IC, 300,000 logic elements

The 5AGXMB1G4F31I3G is an Arria V GX field-programmable gate array (FPGA) in an industrial-grade package, delivering large programmable logic capacity and substantial on-chip memory. It combines 300,000 logic elements and approximately 17.36 Mbits of embedded RAM with up to 384 user I/O pins, making it suitable for dense programmable designs that require broad I/O and embedded memory.

Designed for surface-mount deployment in a 896-ball BGA (896-FBGA, 31×31) package and specified for operation from −40 °C to 100 °C, this device targets industrial applications that need a high-density, configurable logic fabric with well-documented series-level electrical and configuration specifications.

Key Features

  • Logic Capacity  300,000 logic elements and 14,151 CLBs (configurable logic blocks) provide substantial programmable fabric for complex logic, signal processing, and control functions.
  • Embedded Memory  Approximately 17.36 Mbits of on-chip RAM for buffering, lookup tables, and state retention within user designs.
  • I/O and Packaging  384 I/O pins in a compact 896-BBGA / 896-FBGA (31×31) package enable dense routing and connectivity for multi-channel systems.
  • Power Supply  Core voltage supply specified between 1.12 V and 1.18 V to match system power-rail planning and power-delivery design.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C, suitable for thermally demanding environments.
  • Surface Mount Package  Designed for standard surface-mount PCB assembly in a full-array BGA format to support compact system layouts.
  • Standards and Documentation  RoHS compliant; supported by the Arria V device datasheet covering electrical characteristics, switching characteristics, configuration timing, and I/O timing for design verification.

Typical Applications

  • High-density data processing  Implement custom hardware accelerators and parallel processing blocks using the device's large logic element count and embedded RAM.
  • Multi-channel I/O systems  Leverage 384 I/Os and the BGA package for signal aggregation, protocol bridging, and dense interface requirements.
  • Industrial control and automation  Industrial-grade temperature range and robust packaging support control logic, motor control interfaces, and real-time processing in industrial environments.

Unique Advantages

  • Significant programmable capacity: High logic element and CLB counts reduce the need for multiple devices in complex designs.
  • Large on-chip memory: Approximately 17.36 Mbits of embedded RAM enables sizable buffering and local storage without external memory dependency.
  • Broad I/O capabilities: 384 user I/Os in a dense BGA footprint support multi-channel connectivity and flexible board-level integration.
  • Industrial-ready operation: Specified for −40 °C to 100 °C operation for use in thermally challenging or industrial applications.
  • Comprehensive documentation: Backed by Arria V series datasheet material covering electrical, switching, and configuration specifications to support design validation.
  • RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose 5AGXMB1G4F31I3G?

This Arria V GX device balances high logic density, meaningful embedded memory, and extensive I/O in a single industrial-grade BGA package. It is well suited for engineers designing complex programmable systems that require consolidated logic, local RAM, and a compact board footprint.

With series-level documentation covering electrical, switching, and configuration specifications, the 5AGXMB1G4F31I3G is appropriate for development teams focused on scalability, reproducible results, and clear design verification within industrial applications.

If you would like pricing information or a formal quote for 5AGXMB1G4F31I3G, please submit a request for a quote or contact our sales channel to receive a prompt response.

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