5AGXMB1G4F31I3N

The 5AGXMB1G4F31I3N is an Intel Arria V GX family FPGA offered in an industrial-grade configuration. It delivers a high-density programmable fabric with 300,000 logic elements and approximately 17.36 Mbits of embedded memory in a compact 896-BBGA FCBGA package.

With 384 I/O, a supply voltage range of 1.12 V to 1.18 V, surface-mount packaging (896-FBGA, 31×31), and an operating temperature range of −40 °C to 100 °C, this device is targeted at designs that require substantial on-chip logic, memory, and I/O capacity within an industrial temperature envelope.

Key Features

• Core Logic Capacity — 300,000 logic elements for implementing large combinational and sequential designs.
• Embedded Memory — Approximately 17.36 Mbits of on-chip RAM to support data buffering, local storage, and intermediate processing.
• I/O Density — 384 general-purpose I/O pins to handle multi-channel interfaces and parallel data paths.
• Package & Mounting — 896-BBGA, FCBGA package; supplier device package listed as 896-FBGA (31×31); surface-mount for high-density board assembly.
• Power Supply — Core voltage supply range of 1.12 V to 1.18 V.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance — RoHS compliant.
• Documentation — Supported by the Arria V device datasheet covering electrical, switching, configuration, and I/O timing specifications.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature range and high logic/memory capacity for complex control algorithms and real-time processing.
• High-density I/O Systems — 384 I/O supports designs requiring many interfaces, parallel buses, or multi-channel data aggregation.
• Signal Processing and Acceleration — Substantial logic elements and embedded memory to implement on-chip data-paths and buffering for processing tasks.

Unique Advantages

• High Logic Density: 300,000 logic elements enable large-scale integration of custom logic functions on a single device.
• Significant On-chip Memory: Approximately 17.36 Mbits of embedded RAM reduces reliance on external memory for many control and data buffering needs.
• Wide Temperature Range: −40 °C to 100 °C operation supports deployments in demanding industrial environments.
• Generous I/O Count: 384 I/O pins provide the surface area needed for multi-protocol interfacing and parallel data handling.
• Industry-standard Packaging: 896-BBGA (896-FBGA, 31×31) surface-mount package suits high-density PCB layouts and automated assembly.
• Regulatory Compliance: RoHS compliance addresses environmental requirements for many commercial and industrial programs.

Why Choose 5AGXMB1G4F31I3N?

The 5AGXMB1G4F31I3N combines a large programmable fabric with substantial embedded memory and high I/O count in an industrial-grade Arria V GX device. Its operating voltage range, surface-mount 896-BBGA package, and −40 °C to 100 °C rating make it suitable for designs that require on-board logic density, deterministic I/O, and documented electrical and configuration specifications.

This device is well suited to development teams and procurement for industrial applications that demand integration of complex logic, on-chip memory resources, and broad I/O capacity while relying on the Arria V family documentation for electrical and configuration guidance.

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