5AGXMB1G4F35C4G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 17358848 300000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 249 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXMB1G4F35C4G – Arria V GX Field Programmable Gate Array (FPGA)
The 5AGXMB1G4F35C4G is an Intel Arria V GX Field Programmable Gate Array offered in a 1152-ball BGA package. It delivers a high-density programmable fabric with 300,000 logic elements and approximately 17.36 Mbits of embedded RAM, plus a large I/O count for complex board-level integration.
Designed for commercial-grade applications, this device targets designs that require substantial on-chip logic, memory resources, and broad I/O connectivity while operating within a defined core supply range and temperature window.
Key Features
- Programmable logic capacity — 300,000 logic elements for implementing high-density digital designs and custom processing pipelines.
- Embedded memory — Approximately 17.36 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
- Extensive I/O — 544 user I/O pins to support multiple interfaces and board-level connectivity options.
- Package options — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA, FC (35x35).
- Power supply — Core voltage operating range of 1.07 V to 1.13 V for predictable power planning and supply design.
- Mounting & grade — Surface mount device offered in a commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards compliance — RoHS compliant.
- Detailed documentation — Datasheet and device-level electrical/switching/configuration specifications available for system integration and validation.
Typical Applications
- High-density logic implementations — Use the device where up to 300,000 logic elements and substantial on-chip RAM are required to implement custom digital functions.
- Multi-interface systems — Leverage 544 I/O pins to aggregate and bridge multiple board-level interfaces and peripherals.
- Embedded compute and buffering — Utilize approximately 17.36 Mbits of embedded memory for local data storage, FIFOs, and buffering in streaming or packetized systems.
Unique Advantages
- High integration density: 300,000 logic elements and large embedded RAM reduce external component count for complex functions.
- Broad I/O availability: 544 I/O pins enable flexible partitioning of interfaces and peripherals without multiple interface bridges.
- Compact FCBGA packaging: 1152-ball package options provide a space-efficient footprint for board-level designs requiring dense pinout.
- Predictable power window: Defined core supply range (1.07–1.13 V) supports controlled supply design and power budgeting.
- Commercial-grade reliability: Specified operating temperature range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
Why Choose 5AGXMB1G4F35C4G?
The 5AGXMB1G4F35C4G Arria V GX FPGA combines substantial logic capacity, significant on-chip memory, and a wide complement of I/O in a compact 1152-ball BGA package. It is suited to commercial designs that demand programmable hardware resources with clearly defined electrical and thermal envelopes. Backed by device-level documentation, the part supports methodical integration into system designs where density, local memory, and I/O flexibility are key selection criteria.
If you require pricing, availability, or additional technical details for design evaluation, request a quote or submit an inquiry to discuss your requirements and receive a formal quotation.

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