5AGXMB1G4F35C4N

The 5AGXMB1G4F35C4N is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a commercial grade. It provides high logic density and substantial on‑chip memory in a compact surface‑mount 1152‑BBGA package with an exposed pad.

Designed for commercial embedded designs that require large logic capacity, significant embedded RAM, and a high I/O count, this device operates from a nominal core supply range of 1.07 V to 1.13 V and supports an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 300,000 logic elements to implement complex digital designs and large logic fabrics.
• Embedded Memory — Approximately 17.36 Mbits of on‑chip RAM for buffering, lookup tables, and data storage within the device.
• I/O Density — 544 I/O pins to support extensive peripheral and system interfacing requirements.
• Package and Mounting — 1152‑BBGA (FCBGA exposed pad), supplier device package 1152‑FBGA (35×35), optimized for surface‑mount PCB assembly.
• Power Supply — Core voltage supply specified between 1.07 V and 1.13 V for predictable power planning and rail design.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial‑class deployments.
• Standards Compliance — RoHS compliant for environmental regulatory alignment.
• Documentation — Supported by the Arria V device datasheet detailing electrical, switching, configuration, and I/O timing specifications.

Typical Applications

• High‑density commercial FPGA systems — Deployments that require hundreds of thousands of logic elements and multi‑Mbit embedded memory.
• Systems requiring high I/O integration — Designs needing a large number of external interfaces supported by 544 I/O pins.
• Compact surface‑mount assemblies — Board designs that benefit from a 1152‑BBGA package with an exposed pad for thermal and mechanical integration.

Unique Advantages

• Substantial logic resources: 300,000 logic elements enable implementation of complex logic, data paths, and custom processing within a single device.
• Large on‑chip memory: Approximately 17.36 Mbits of embedded RAM reduces the need for external memory in many buffering and LUT use cases.
• High peripheral connectivity: 544 I/O pins give designers flexibility to connect multiple interfaces and external peripherals without external multiplexing.
• Commercial‑grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance to meet standard commercial deployment requirements.
• Compact, manufacturable package: 1152‑BBGA (35×35) with exposed pad supports standard surface‑mount assembly and thermal considerations.

Why Choose 5AGXMB1G4F35C4N?

The 5AGXMB1G4F35C4N Arria V GX FPGA combines high logic density, multi‑Mbit embedded memory, and a large I/O count in a commercial‑grade, surface‑mount 1152‑BBGA package. Its specified core voltage range and operating temperature make it suitable for a wide range of commercial embedded systems where integration and on‑chip resources are critical.

Backed by the Arria V device datasheet and Intel documentation, this part is targeted at designers and procurement teams needing a scalable, well‑documented FPGA building block for commercial products and prototypes.

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