5AGXMB1G4F31I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 17358848 300000 896-BBGA, FCBGA |
|---|---|
| Quantity | 778 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXMB1G4F31I5N – Arria V GX Field Programmable Gate Array (FPGA) IC 384 I/O, ~17.36 Mbits RAM, 300,000 Logic Elements, 896-BBGA FCBGA
The 5AGXMB1G4F31I5N is an Arria V GX FPGA from Intel, delivered in a high–pin-count 896‑BBGA FCBGA package. It provides 300,000 logic elements, approximately 17.36 Mbits of embedded memory, and 384 programmable I/O pins, enabling dense, flexible programmable logic implementations.
Designed and specified for industrial environments, this device operates over a wide temperature range and uses a tightly controlled core supply, making it suitable for designs that require high logic density, substantial on‑chip memory, and abundant I/O in a compact, surface‑mount package.
Key Features
- Core Logic Capacity 300,000 logic elements for complex programmable logic and high-density design integration.
- Embedded Memory Approximately 17.36 Mbits of on‑chip RAM to support buffering, state machines, and local data storage without external memory.
- I/O Resources 384 I/O pins provide extensive connectivity for high‑pin‑count interfaces and system integration.
- Package & Mounting 896‑BBGA, FCBGA package; supplier device package listed as 896‑FBGA (31×31). Surface‑mount mounting type simplifies PCB assembly for automated production.
- Power Supply Core voltage supply range specified at 1.07 V to 1.13 V for precise power sequencing and stable core operation.
- Industrial Grade & Temperature Rated grade: Industrial. Operating temperature range from −40 °C to 100 °C for deployment in demanding ambient conditions.
Typical Applications
- Industrial Control Systems Industrial temperature rating and plentiful I/O make this FPGA suitable for programmable control, motion control, and factory automation logic.
- High‑Density Logic Implementation Large logic element count and significant embedded RAM enable complex digital signal processing, protocol bridging, and custom accelerator functions.
- Prototyping and System Integration Abundant I/O and high logic capacity support platform prototyping and integration of multiple peripheral functions into a single device.
Unique Advantages
- High Logic Density: With 300,000 logic elements, consolidate multiple functions into one programmable device to reduce component count.
- Substantial On‑Chip Memory: Approximately 17.36 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
- Extensive I/O Count: 384 I/O pins provide flexibility for multi‑lane interfaces, parallel buses, and mixed‑signal front‑end integration.
- Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployment in temperature‑sensitive industrial environments.
- Compact High‑Pin Package: The 896‑BBGA FCBGA (supplier: 896‑FBGA, 31×31) balances high pin count with a compact board footprint.
- Controlled Core Supply Window: Specified 1.07 V to 1.13 V core supply helps ensure predictable core behavior and power sequencing.
Why Choose 5AGXMB1G4F31I5N?
The 5AGXMB1G4F31I5N positions itself for designs that require a combination of high logic capacity, substantial embedded memory, and broad I/O in an industrial‑rated FPGA. Its package and surface‑mount form factor enable compact system layouts while providing the pin count necessary for complex interfaces.
Backed by Arria V family documentation, this device is suitable for engineers seeking a robust, high‑density programmable solution for industrial and high‑functionality applications where predictable power and thermal performance are important.
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