5AGXMB1G4F35C5N

The 5AGXMB1G4F35C5N is an Arria V GX field programmable gate array (FPGA) from Intel, offered in a commercial grade device. It provides a high-density programmable fabric with 300,000 logic elements and approximately 17.36 Mbits of embedded memory, designed for applications that require extensive on-chip resources and a large number of I/O connections.

Packaged in a 1152-BBGA FCBGA exposed pad (supplier package: 1152-FBGA, 35×35) and intended for surface-mount assembly, this device supports designs constrained to a core supply voltage range of 1.07 V to 1.13 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• High-density programmable logic — 300,000 logic elements for complex, highly parallel functions and custom logic implementation.
• On-chip memory — Approximately 17.36 Mbits of embedded RAM for buffering, packet processing, and accelerator workloads.
• Extensive I/O — 544 user I/Os to support wide external interfaces and high-pin-count peripheral connectivity.
• Package and mounting — 1152-BBGA, FCBGA exposed pad (supplier: 1152-FBGA 35×35) optimized for surface-mount PCB assembly and thermal conduction through the exposed pad.
• Power and core supply — Core voltage specified from 1.07 V to 1.13 V to match system power-rail design requirements.
• Commercial operating range — Rated for 0 °C to 85 °C operation (commercial grade).
• RoHS compliant — Conforms to RoHS requirements for restricted substances.

Typical Applications

• High-density logic systems — Implement complex custom datapaths and processing engines using 300,000 logic elements and abundant embedded memory.
• I/O-intensive platforms — Support extensive peripheral interfacing and multi-channel connectivity using 544 user I/Os.
• Embedded acceleration — Use on-chip RAM and programmable logic to offload compute tasks and accelerate specific algorithms.
• Prototyping and system integration — Surface-mount BBGA package with exposed pad facilitates integration on production PCBs for evaluation and deployment.

Unique Advantages

• Large programmable fabric: 300,000 logic elements provide headroom for complex designs and parallel implementations without external logic expansion.
• Substantial on-chip RAM: Approximately 17.36 Mbits of embedded memory reduces reliance on external memory for many buffering and local storage tasks.
• Massive I/O count: 544 I/Os enable broad external interfacing options and flexible pinout partitioning for multi-protocol designs.
• Commercial-grade operation: Specified for 0 °C to 85 °C, suitable for standard commercial electronics and controlled-environment applications.
• Surface-mount BBGA with exposed pad: Facilitates thermal management and compact PCB footprint for space-constrained designs.
• RoHS compliant: Meets environmental substance restrictions relevant to modern production and compliance policies.

Why Choose 5AGXMB1G4F35C5N?

The 5AGXMB1G4F35C5N Arria V GX FPGA combines a high-density logic fabric, substantial embedded memory, and a large I/O complement in a production-ready BBGA package. Its electrical and mechanical specifications make it suitable for engineers developing complex, I/O-heavy, or memory-dependent FPGA designs where a commercial-grade, surface-mount solution is required.

This device is aimed at teams that need scalable programmable resources with clear electrical requirements (1.07 V–1.13 V core supply) and a standard commercial temperature range, enabling predictable integration into established development and manufacturing flows.

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