5AGXMB1G4F40C4G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 17358848 300000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 613 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXMB1G4F40C4G – Arria V GX FPGA, 300,000 logic elements, 1517-BBGA
The 5AGXMB1G4F40C4G is an Intel Arria V GX field-programmable gate array (FPGA) supplied in a 1517-BBGA (FCBGA) package for surface-mount assembly. This commercial-grade device provides a large programmable fabric (approximately 300,000 logic elements), substantial on-chip RAM (approximately 17.36 Mbits), and up to 704 user I/O pins, enabling complex, high-density digital designs that require significant logic and memory resources.
Key Features
- Logic Capacity Approximately 300,000 logic elements to implement complex custom logic, state machines, and data-paths.
- Embedded Memory Approximately 17.36 Mbits of on-chip RAM to support buffering, block RAM usage, and local data storage required by compute-intensive designs.
- I/O Density Up to 704 user I/O pins, providing broad connectivity options for parallel interfaces and high-pin-count peripherals.
- Power Supply Core supply operating range of 1.07 V to 1.13 V, enabling designers to size power delivery for the device core according to specified limits.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA, FC (40×40); surface-mount mounting for board-level integration.
- Operating Range Commercial-grade operation from 0 °C to 85 °C, suitable for standard commercial and enterprise environments.
- Standards & Compliance RoHS compliant to meet common environmental regulatory requirements.
Typical Applications
- Networking & Communications Designed for logic- and memory-intensive functions where high I/O count and large programmable fabric are required for packet processing and interface bridging.
- Signal Processing Suitable for implementations that need significant on-chip RAM and logic resources for buffering, filtering, and data path acceleration.
- Custom Compute & Prototyping Well-suited for hardware prototyping and custom accelerator development where a high logic element count and flexible I/O are essential.
Unique Advantages
- Large Programmable Fabric: The approximately 300,000 logic elements enable implementation of complex algorithms and dense logic integration on a single device.
- Substantial On-Chip Memory: Approximately 17.36 Mbits of embedded RAM reduces dependence on external memory for many buffering and local-storage tasks, simplifying system design.
- High I/O Count: Up to 704 I/O pins provide flexibility for multiple parallel interfaces, custom bus implementations, and extensive external connectivity.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation for standard commercial deployments.
- Surface-Mount BBGA Package: 1517-BBGA (FCBGA) package supports compact board layouts while delivering the required pin density for high-performance designs.
- Regulatory Compliance: RoHS compliance supports environmentally conscious product development and supply chain requirements.
Why Choose 5AGXMB1G4F40C4G?
The 5AGXMB1G4F40C4G Arria V GX FPGA delivers a balance of high logic capacity, significant embedded memory, and extensive I/O in a commercial-grade, surface-mount BBGA package. It is targeted at designers who need a programmable, high-density solution for complex digital functions where on-chip resources minimize external components and simplify board-level architecture.
This device is appropriate for teams developing networking, signal processing, and custom compute solutions that require scalability, robust on-chip resources, and RoHS compliance. Its specified voltage and temperature limits enable predictable integration into commercial electronic systems.
Request a quote or submit your specifications to receive pricing and availability details for the 5AGXMB1G4F40C4G.

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