5AGXMB1G4F40C5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 17358848 300000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,206 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXMB1G4F40C5G – Arria V GX FPGA, 300,000 logic elements
The 5AGXMB1G4F40C5G is an Intel Arria V GX Field Programmable Gate Array (FPGA) IC offering a high logic capacity and significant embedded memory in a compact ball-grid package. With 300,000 logic elements, approximately 17.36 Mbits of embedded RAM, and 704 I/O, it is aimed at designs that require dense logic integration, substantial on-chip memory, and large I/O counts while operating within a commercial temperature range.
Key Features
- Core Logic 300,000 logic elements provide substantial programmable logic resources for complex digital designs.
- Embedded Memory Approximately 17.36 Mbits of on-chip RAM to support buffering, state machines, and data-path requirements without immediate reliance on external memory.
- I/O Capacity 704 I/O pins to accommodate extensive external interfacing and parallel connectivity needs.
- Power Nominal supply voltage range of 1.07 V to 1.13 V for core power domains.
- Package and Mounting 1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA, FC (40×40), designed for surface-mount assembly.
- Operating Conditions & Compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High-density digital systems — Implement complex logic functions and custom datapaths using the extensive logic element count and embedded RAM.
- Multi-channel interfacing — Use the high I/O count to connect multiple parallel interfaces, sensors, or peripheral blocks directly to the FPGA.
- Memory-intensive algorithms — Leverage the on-chip RAM for buffering and intermediate storage in signal processing or control applications.
Unique Advantages
- High logic integration: 300,000 logic elements let you consolidate functions that would otherwise require multiple devices, reducing board-level complexity.
- Substantial on-chip RAM: Approximately 17.36 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage needs.
- Extensive I/O support: 704 I/O pins enable broad connectivity for multi-channel or highly parallel designs.
- Compact surface-mount package: 1517-BBGA (FCBGA) provides a dense footprint suitable for space-constrained boards while supporting high pin counts.
- Clear operating envelope: Commercial temperature rating (0 °C to 85 °C) and a defined core voltage range (1.07 V–1.13 V) simplify power and thermal planning.
- Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose 5AGXMB1G4F40C5G?
The 5AGXMB1G4F40C5G positions itself as a high-capacity Arria V GX FPGA option for designers who need a combination of large logic resources, significant on-chip memory, and wide I/O capability in a commercial-grade, surface-mount package. Its defined supply and temperature ranges, together with RoHS compliance, provide a predictable platform for system-level integration.
This device is well suited for engineering teams implementing dense digital functions, extensive interfacing, or memory-aware processing where device-level integration and a compact package help streamline board-level design and component sourcing.
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