5AGXMB1G6F31C6G

The 5AGXMB1G6F31C6G is an Arria V GX field-programmable gate array (FPGA) in a surface-mount 896-ball BGA package. This commercial‑grade device integrates 300,000 logic elements and approximately 17.36 Mbits of embedded RAM to support complex, high‑density digital designs.

With 384 user I/O, a tightly controlled core supply range (1.07 V to 1.13 V), and an operating temperature range of 0 °C to 85 °C, the device targets applications that require significant on‑chip logic, abundant memory, and extensive I/O connectivity in a compact FCBGA footprint.

Key Features

• Logic Capacity  300,000 logic elements to implement large combinational and sequential logic functions.
• Embedded Memory  Approximately 17.36 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑mapped logic structures.
• High I/O Count  384 user I/O pins to support wide parallel interfaces and diverse peripheral connectivity.
• Package & Mounting  896‑ball FCBGA (896‑BBGA, 31×31) package designed for surface‑mount assembly and dense board integration.
• Power  Core supply voltage specified between 1.07 V and 1.13 V for defined core operation.
• Operating Range  Commercial grade device rated for 0 °C to 85 °C ambient operating temperature.
• Compliance  RoHS compliant.

Typical Applications

• High‑Density Digital Systems  Large logic capacity and embedded RAM make the device suitable for complex pattern processing and protocol implementation.
• Multi‑I/O Interface Hubs  384 I/O pins enable aggregation and bridging between multiple parallel or parallel/serial interfaces.
• Embedded Acceleration  On‑chip memory and abundant logic elements support hardware acceleration and custom datapath designs.

Unique Advantages

• Substantial Logic Resources:  300,000 logic elements provide the headroom to integrate large custom logic blocks and control functions on a single device.
• Significant Embedded RAM:  Approximately 17.36 Mbits of on‑chip memory reduces external memory dependency for buffering and state storage.
• High I/O Density:  384 user I/O simplifies board routing and minimizes the need for multiple interface chips.
• Compact BGA Package:  896‑ball FCBGA (31×31) delivers high pin count in a compact footprint for space‑constrained designs.
• Deterministic Core Power Range:  Clearly defined core voltage (1.07 V–1.13 V) supports precise power planning and thermal design.
• Commercial Grade Availability:  Designed for commercial temperature environments (0 °C–85 °C) for mainstream embedded and communications products.

Why Choose 5AGXMB1G6F31C6G?

The 5AGXMB1G6F31C6G Arria V GX FPGA combines substantial logic density, embedded memory, and a high I/O count in a compact 896‑ball FCBGA package, offering a balanced platform for demanding digital designs. Its defined core supply range and commercial operating temperature make it suitable for systems where integration, deterministic power planning, and dense I/O are priorities.

This device is well suited to engineering teams designing mid‑ to high‑complexity FPGA solutions that require on‑chip memory, extensive interfacing, and a compact board footprint, while maintaining RoHS compliance and commercial temperature support.

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